Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> CM8062301044204S R05Y

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CM8062301044204S R05Y: 产品描述CPU - Central Processing Units Core i3-2120 Dual CR 3.3GHz FCLGA1155; 产品类别半导体嵌入式处理器和控制器; 文件大小776KB，共113页; 制造商Intel(英特尔); 官网地址http://www.intel.com/; 标准

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CM8062301044204S R05Y概述

CPU - Central Processing Units Core i3-2120 Dual CR 3.3GHz FCLGA1155

CM8062301044204S R05Y规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units
RoHS	Details
产品 Product	Desktop Processors
封装 / 箱体 Package / Case	FCLGA-1155
Family	Intel Core i3
Core	Intel Core i3
Code Name	Sandy Bridge
Processor Series	i3-2120
Embedded Options	Embedded
Number of Cores	2 Core
TDP - Max	65 W
Maximum Clock Frequency	3.3 GHz
Data Bus Width	64 bit
Memory Size	32 GB
Memory Type	DDR3-1066/1333
System Bus Type	DMI
System Bus Speed	5 GT/s
Cache Memory	3 MB
最大工作温度 Maximum Operating Temperature	+ 69.1 C
系列 Packaging	Tray
Package / Case Size	37.5 mm x 37.5 mm
安装风格 Mounting Style	SMD/SMT
CPU Configuration - Max	1 Configuration
Intel Hyper-Threading Technology	With HT Technology
Intel Virtualization Technology - VT	With VT
Lithography - Process Technology	32 nm
Number of Displays Supported	2 Display
Number of Memory Channels	2 Channel
Number of PCI Express Lanes	16 Lane
Number of Threads	4 Thread
PCIe Revision	Revision 2.0
工厂包装数量 Factory Pack Quantity	1

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2nd Generation Intel

Core™

Processor Family Desktop, Intel

Pentium

Processor Family Desktop,

and Intel

Celeron

Processor

Family Desktop

Datasheet, Volume 1

Supporting Intel

Core™ i7, i5, and i3 Desktop Processor Series

Supporting Intel

Pentium

Processor G800 and G600 Series

Supporting Intel

Celeron

Processor G500 and G400 Series

This is Volume 1 of 2

June 2013

Document Number: 324641-008

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

Legal Lines and Disclaimers

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY

APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH

MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

All products, platforms, dates, and figures specified are preliminary based on current expectations, and are subject to change

without notice. All dates specified are target dates, are provided for planning purposes only and are subject to change.

No computer system can provide absolute security under all conditions. Intel

Trusted Execution Technology (Intel

TXT) requires

a computer system with Intel

Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code

Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor,

an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing

Group and specific software for some uses. For more information, see

http://www.intel.com/technology/security/

Intel

Virtualization Technology requires a computer system with an enabled Intel

processor, BIOS, virtual machine monitor

(VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary

depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible

with all operating systems. Please check with your application vendor.

Intel

Active Management Technology requires the computer system to have an Intel(R) AMT-enabled chipset, network hardware

and software, as well as connection with a power source and a corporate network connection. Setup requires configuration by the

purchaser and may require scripting with the management console or further integration into existing security frameworks to

enable certain functionality. It may also require modifications of implementation of new business processes. With regard to

notebooks, Intel AMT may not be available or certain capabilities may be limited over a host OS-based VPN or when connecting

wirelessly, on battery power, sleeping, hibernating or powered off. For more information, see

http://www.intel.com/technology/

platform-technology/intel-amt/

Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-

enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For

more information including details on which processors support HT Technology, see htp://www.intel.com/info/hyperthreading.

“Intel

Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost

Technology performance varies depending on hardware, software and overall system configuration. Check with your PC

manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see

http://www.intel.com/

technology/turboboost.”

Enhanced Intel

SpeedStep

Technology See the Processor Spec Finder or contact your Intel representative for more information.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,

not across different processor families. See

www.intel.com/products/processor_number for details.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel

64 architecture. Performance will vary depending on your hardware and software

configurations. Consult with your system vendor for more information.

Code names featured are used internally within Intel to identify products that are in development and not yet publicly announced

for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or

marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user.

Intel, Intel Core, Celeron, Pentium, Speedstep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other

countries.

*Other names and brands may be claimed as the property of others.

Datasheet, Volume 1

Contents

Introduction

.............................................................................................................. 9

1.1

Processor Feature Details ................................................................................... 11

1.1.1 Supported Technologies .......................................................................... 11

1.2

Interfaces ........................................................................................................ 11

1.2.1 System Memory Support ......................................................................... 11

1.2.2 PCI Express* ......................................................................................... 12

1.2.3 Direct Media Interface (DMI).................................................................... 13

1.2.4 Platform Environment Control Interface (PECI) ........................................... 14

1.2.5 Processor Graphics ................................................................................. 14

1.2.6 Intel

Flexible Display Interface (Intel

FDI) ............................................. 14

1.3

Power Management Support ............................................................................... 15

1.3.1 Processor Core....................................................................................... 15

1.3.2 System ................................................................................................. 15

1.3.3 Memory Controller.................................................................................. 15

1.3.4 PCI Express* ......................................................................................... 15

1.3.5 Direct Media Interface (DMI).................................................................... 15

1.3.6 Processor Graphics Controller................................................................... 15

1.4

Thermal Management Support ............................................................................ 15

1.5

Package ........................................................................................................... 16

1.6

Terminology ..................................................................................................... 16

1.7

Related Documents ........................................................................................... 18

Interfaces................................................................................................................

2.1

System Memory Interface .................................................................................. 19

2.1.1 System Memory Technology Supported ..................................................... 19

2.1.2 System Memory Timing Support............................................................... 21

2.1.3 System Memory Organization Modes......................................................... 21

2.1.3.1 Single-Channel Mode................................................................. 21

2.1.3.2 Dual-Channel Mode – Intel

Flex Memory Technology Mode ........... 21

2.1.4 Rules for Populating Memory Slots ............................................................ 22

2.1.5 Technology Enhancements of Intel

Fast Memory Access (Intel

FMA).......... 23

2.1.5.1 Just-in-Time Command Scheduling.............................................. 23

2.1.5.2 Command Overlap .................................................................... 23

2.1.5.3 Out-of-Order Scheduling ............................................................ 23

2.1.6 Memory Type Range Registers (MTRRs) Enhancement................................. 23

2.1.7 Data Scrambling .................................................................................... 23

2.2

PCI Express* Interface....................................................................................... 24

2.2.1 PCI Express* Architecture ....................................................................... 24

2.2.1.1 Transaction Layer ..................................................................... 25

2.2.1.2 Data Link Layer ........................................................................ 25

2.2.1.3 Physical Layer .......................................................................... 25

2.2.2 PCI Express* Configuration Mechanism ..................................................... 26

2.2.3 PCI Express* Port................................................................................... 26

2.2.4 PCI Express* Lanes Connection ................................................................ 27

2.3

Direct Media Interface (DMI)............................................................................... 27

2.3.1 DMI Error Flow....................................................................................... 27

2.3.2 Processor / PCH Compatibility Assumptions................................................ 27

2.3.3 DMI Link Down ...................................................................................... 28

2.4

Processor Graphics Controller (GT) ...................................................................... 28

2.4.1 3D and Video Engines for Graphics Processing............................................ 29

2.4.1.1 3D Engine Execution Units ......................................................... 29

Datasheet, Volume 1

2.5

2.6

2.4.1.2 3D Pipeline ...............................................................................29

2.4.1.3 Video Engine ............................................................................30

2.4.1.4 2D Engine ................................................................................30

2.4.2 Processor Graphics Display ......................................................................31

2.4.2.1 Display Planes ..........................................................................31

2.4.2.2 Display Pipes ............................................................................32

2.4.2.3 Display Ports ............................................................................32

2.4.3 Intel

Flexible Display Interface (Intel

FDI) .............................................32

2.4.4 Multi-Graphics Controller Multi-Monitor Support ..........................................32

Platform Environment Control Interface (PECI) ......................................................33

Interface Clocking..............................................................................................33

2.6.1 Internal Clocking Requirements ................................................................33

Technologies............................................................................................................35

3.1

Intel

Virtualization Technology (Intel

VT) ..........................................................35

3.1.1 Intel

Virtualization Technology (Intel

VT) for

IA-32, Intel

64 and Intel

Architecture

(Intel

VT-x) Objectives ..........................................................................35

3.1.2 Intel

Virtualization Technology (Intel

VT) for

IA-32, Intel

64 and Intel

Architecture

(Intel

VT-x) Features ............................................................................36

3.1.3 Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Objectives ....................................................................36

3.1.4 Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Features.......................................................................37

3.1.5 Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Features Not Supported..................................................37

3.2

Intel

Trusted Execution Technology (Intel

TXT) .................................................38

3.3

Intel

Hyper-Threading Technology (Intel

HT Technology) ....................................38

3.4

Intel

Turbo Boost Technology ............................................................................39

3.4.1 Intel

Turbo Boost Technology Frequency..................................................39

3.4.2 Intel

Turbo Boost Technology Graphics Frequency.....................................39

3.5

Intel

Advanced Vector Extensions (Intel

AVX)....................................................40

3.6

Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI) ...................40

3.6.1 PCLMULQDQ Instruction ..........................................................................40

3.7

Intel

64 Architecture x2APIC .............................................................................40

Power Management

.................................................................................................43

4.1

Advanced Configuration and Power Interface (ACPI) States Supported ......................44

4.1.1 System States........................................................................................44

4.1.2 Processor Core / Package Idle States.........................................................44

4.1.3 Integrated Memory Controller States .........................................................44

4.1.4 PCI Express* Link States .........................................................................44

4.1.5 Direct Media Interface (DMI) States ..........................................................45

4.1.6 Processor Graphics Controller States .........................................................45

4.1.7 Interface State Combinations ...................................................................45

4.2

Processor Core Power Management ......................................................................46

4.2.1 Enhanced Intel

SpeedStep

Technology ..................................................46

4.2.2 Low-Power Idle States.............................................................................46

4.2.3 Requesting Low-Power Idle States ............................................................48

4.2.4 Core C-states .........................................................................................48

4.2.4.1 Core C0 State ...........................................................................48

4.2.4.2 Core C1/C1E State ....................................................................49

4.2.4.3 Core C3 State ...........................................................................49

4.2.4.4 Core C6 State ...........................................................................49

4.2.4.5 C-State Auto-Demotion ..............................................................49

4.2.5 Package C-States ...................................................................................50

Datasheet, Volume 1

4.3

4.4

4.5

4.6

4.7

4.2.5.1 Package C0 .............................................................................. 51

4.2.5.2 Package C1/C1E ....................................................................... 51

4.2.5.3 Package C3 State...................................................................... 52

4.2.5.4 Package C6 State...................................................................... 52

Integrated Memory Controller (IMC) Power Management ........................................ 52

4.3.1 Disabling Unused System Memory Outputs ................................................ 52

4.3.2 DRAM Power Management and Initialization ............................................... 53

4.3.2.1 Initialization Role of CKE ............................................................ 54

4.3.2.2 Conditional Self-Refresh ............................................................ 54

4.3.2.3 Dynamic Power-down Operation ................................................. 55

4.3.2.4 DRAM I/O Power Management .................................................... 55

PCI Express* Power Management ........................................................................ 55

Direct Media Interface (DMI) Power Management .................................................. 55

Graphics Power Management .............................................................................. 56

4.6.1 Intel

Rapid Memory Power Management (Intel

RMPM)

(also known as CxSR) ............................................................................. 56

4.6.2 Intel

Graphics Performance Modulation Technology (Intel

GPMT) .............. 56

4.6.3 Graphics Render C-State ......................................................................... 56

4.6.4 Intel

Smart 2D Display Technology (Intel

S2DDT) .................................. 56

4.6.5 Intel

Graphics Dynamic Frequency.......................................................... 57

Thermal Power Management ............................................................................... 57

Thermal Management

.............................................................................................. 59

Signal Description

................................................................................................... 61

6.1

System Memory Interface Signals........................................................................ 62

6.2

Memory Reference and Compensation Signals ....................................................... 63

6.3

Reset and Miscellaneous Signals.......................................................................... 64

6.4

PCI Express*-Based Interface Signals .................................................................. 65

6.5

Intel

Flexible Display Interface (Intel

FDI) Signals ............................................. 65

6.6

Direct Media Interface (DMI) Signals.................................................................... 66

6.7

Phase Lock Loop (PLL) Signals ............................................................................ 66

6.8

Test Access Points (TAP) Signals ......................................................................... 66

6.9

Error and Thermal Protection Signals ................................................................... 67

6.10 Power Sequencing Signals .................................................................................. 67

6.11 Processor Power Signals ..................................................................................... 68

6.12 Sense Signals ................................................................................................... 68

6.13 Ground and Non-Critical to Function (NCTF) Signals ............................................... 68

6.14 Processor Internal Pull-Up / Pull-Down Resistors.................................................... 69

Electrical Specifications

........................................................................................... 71

7.1

Power and Ground Lands.................................................................................... 71

7.2

Decoupling Guidelines ........................................................................................ 71

7.2.1 Voltage Rail Decoupling........................................................................... 71

7.3

Processor Clocking (BCLK[0], BCLK#[0]) .............................................................. 72

7.3.1 Phase Lock Loop (PLL) Power Supply......................................................... 72

7.4

Voltage Identification (VID) .......................................................................... 72

7.5

System Agent (SA) VCC VID ............................................................................... 76

7.6

Reserved or Unused Signals................................................................................ 76

7.7

Signal Groups ................................................................................................... 77

7.8

Test Access Port (TAP) Connection....................................................................... 78

7.9

Storage Conditions Specifications ........................................................................ 79

7.10 DC Specifications .............................................................................................. 80

7.10.1 Voltage and Current Specifications............................................................ 80

7.11 Platform Environmental Control Interface (PECI) DC Specifications........................... 86

7.11.1 PECI Bus Architecture ............................................................................. 86

7.11.2 DC Characteristics .................................................................................. 87

Datasheet, Volume 1

CM8062301044204S R05Y相似产品对比

	CM8062301044204S R05Y	CM8062307260237S-R058	LE80536GC0332MS-LJ8Z	CM8062301061600S R05C	LE80536GC0332M-SLJ8Z
描述	CPU - Central Processing Units Core i3-2120 Dual CR 3.3GHz FCLGA1155	CPU - Central Processing Units Pentium G860 Dual CR 3.00GHz FCLGA1155	CPU - Central Processing Units Pentium 745 Single Core 1.8GHz HPBGA479	CPU - Central Processing Units Core i3-2100 Dual CR 3.10GHz FCLGA1155	CPU - Central Processing Units
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
制造商 Manufacturer	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units
RoHS	Details	-	Details	Details	-
封装 / 箱体 Package / Case	FCLGA-1155	-	HPBGA-479	-	HPBGA
Family	Intel Core i3	-	Intel Pentium M	-	Intel Pentium M
Data Bus Width	64 bit	-	32 bit	-	64 bit
System Bus Speed	5 GT/s	-	400 MHz	-	1800 MHz
系列 Packaging	Tray	Tray	Tray	Tray	-
工厂包装数量 Factory Pack Quantity	1	1	1	1	-

CM8062301044204S R05Y

CM8062301044204S R05Y概述

CM8062301044204S R05Y规格参数

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CM8062301044204S R05Y相似产品对比

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