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74HCT151DB,112: 产品描述Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER; 产品类别逻辑逻辑; 文件大小796KB，共18页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74HCT151DB,112概述

Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER

74HCT151DB,112规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SSOP1
包装说明	SSOP, SSOP16,.3
针数	16
制造商包装代码	SOT338-1
Reach Compliance Code	compliant
系列	HCT
JESD-30 代码	R-PDSO-G16
JESD-609代码	e4
长度	6.2 mm
负载电容（CL）	50 pF
逻辑集成电路类型	MULTIPLEXER
最大I（ol）	0.004 A
湿度敏感等级	1
功能数量	1
输入次数	8
输出次数	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
输出极性	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY
封装代码	SSOP
封装等效代码	SSOP16,.3
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH
包装方法	TUBE
峰值回流温度（摄氏度）	260
电源	5 V
Prop。Delay @ Nom-Sup	57 ns
传播延迟（tpd）	62 ns
认证状态	Not Qualified
座面最大高度	2 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	5.3 mm

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74HC151; 74HCT151

8-input multiplexer

Rev. 6 — 28 December 2015

Product data sheet

1. General description

The 74HC151; 74HCT151 are 8-bit multiplexer with eight binary inputs (I0 to I7), three

select inputs (S0 to S2) and an enable input (E). One of the eight binary inputs is selected

by the select inputs and routed to the complementary outputs (Y and Y). A HIGH on E

forces the output Y LOW and output Y HIGH. Inputs also include clamp diodes that enable

the use of current limiting resistors to interface inputs to voltages in excess of V

2. Features and benefits



Specified in compliance with JEDEC standard no. 7A



Input levels:



For 74HC151: CMOS level



For 74HCT151: TTL level



Low-power dissipation



Non-inverting data path



ESD protection:



HBM JESD22-A114F exceeds 2 000 V



MM JESD22-A115-A exceeds 200 V



Multiple package options



Specified from

40 C

to +85

C

and from

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74HC151D

74HCT151D

74HC151DB

74HCT151DB

74HC151PW

74HCT151PW

40 C

to +125

C

TSSOP16

40 C

to +125

C

SSOP16

40 C

to +125

C

Name

SO16

Description

Version

plastic small outline package; 16 leads; body width SOT109-1

3.9 mm

plastic shrink small outline package; 16 leads;

body width 5.3 mm

SOT338-1

Type number

plastic thin shrink small outline package; 16 leads; SOT403-1

body width 4.4 mm

74HCT151DB,112相似产品对比

	74HCT151DB,112	74HCT151PW,112	74HC151DB,118	74HCT151D,652	74HC151PW,112	74HC151D,653	74HCT151DB
描述	Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER	Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER	Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER	Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MUX	Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER	Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER	Encoders, Decoders, Multiplexers & Demultiplexers 8-INPUT MULTIPLEXER
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	SSOP1	TSSOP	SSOP1	SOP	TSSOP	SOP	SOIC
包装说明	SSOP, SSOP16,.3	TSSOP, TSSOP16,.25	SSOP, SSOP16,.3	SOP, SOP16,.25	TSSOP, TSSOP16,.25	SO-16	SSOP, SSOP16,.3
针数	16	16	16	16	16	16	16
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
系列	HCT	HCT	HC/UH	HCT	HC/UH	HC/UH	HCT
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
JESD-609代码	e4	e4	e4	e4	e4	e4	e4
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
最大I（ol）	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
湿度敏感等级	1	1	1	1	1	1	1
功能数量	1	1	1	1	1	1	1
输入次数	8	8	8	8	8	8	8
输出次数	1	1	1	1	1	1	1
端子数量	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出极性	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SSOP	TSSOP	SSOP	SOP	TSSOP	SOP	SSOP
封装等效代码	SSOP16,.3	TSSOP16,.25	SSOP16,.3	SOP16,.25	TSSOP16,.25	SOP16,.25	SSOP16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260
电源	5 V	5 V	2/6 V	5 V	2/6 V	2/6 V	5 V
Prop。Delay @ Nom-Sup	57 ns	57 ns	51 ns	57 ns	51 ns	51 ns	65 ns
传播延迟（tpd）	62 ns	62 ns	56 ns	62 ns	56 ns	56 ns	62 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	6 V	5.5 V	6 V	6 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	2 V	4.5 V	2 V	2 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	1.27 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-
制造商包装代码	SOT338-1	SOT403-1	SOT338-1	SOT109-1	SOT403-1	SOT109-1	-
长度	6.2 mm	5 mm	6.2 mm	-	5 mm	-	6.2 mm
包装方法	TUBE	TUBE	TAPE AND REEL	BULK PACK	-	TAPE AND REEL	-
座面最大高度	2 mm	1.1 mm	2 mm	-	1.1 mm	-	2 mm
宽度	5.3 mm	4.4 mm	5.3 mm	-	4.4 mm	-	5.3 mm

74HCT151DB,112

74HCT151DB,112概述

74HCT151DB,112规格参数

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