Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.25/13.2 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电流 (Isup) | 2.5 mA |
| 最大供电电压 (Vsup) | 13.2 V |
| 最小供电电压 (Vsup) | 2.25 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| MAX5925BEUB+ | MAX5926EEE-T | MAX5925CEUB+ | MAX5926EEE+ | MAX5926EEE | MAX5925AEUB+ | MAX5924BEUB+ | MAX5925BEUB+T | MAX5924DEUB+ | MAX5924AEUB+ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1V to 13.2V, n-Channel Hot-Swap Controller Requires No Sense Resistor | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller | Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller |
| 是否无铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | TSSOP | SOIC | TSSOP | SOIC | SOIC | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | TSSOP, TSSOP10,.19,20 | 0.150 INCH, QSOP-16 | TSSOP, TSSOP10,.19,20 | HLSSOP, SSOP16,.25 | 0.150 INCH, QSOP-16 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 | 16 | 10 | 16 | 16 | 10 | 10 | 10 | 10 | 10 |
| Reach Compliance Code | compliant | not_compliant | compliant | compliant | not_compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PDSO-G10 | R-PDSO-G16 | S-PDSO-G10 | R-PDSO-G16 | R-PDSO-G16 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e4 | e0 | e4 | e3 | e0 | e4 | e4 | e3 | e4 | e4 |
| 长度 | 3 mm | 4.89 mm | 3 mm | 4.89 mm | 4.89 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 16 | 10 | 16 | 16 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HLSSOP | TSSOP | HLSSOP | HLSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 | SSOP16,.25 | TSSOP10,.19,20 | SSOP16,.25 | SSOP16,.25 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 260 | 260 | 245 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V | 2.25/13.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.65 mm | 1.1 mm | 1.65 mm | 1.65 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电流 (Isup) | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA |
| 最大供电电压 (Vsup) | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V |
| 最小供电电压 (Vsup) | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3.9 mm | 3 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
| Factory Lead Time | 1 week | - | 1 week | 9 weeks | - | 6 weeks | 9 weeks | - | 9 weeks | 1 week |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
ADI参考电路
PCB设计
电子竞赛
嵌入式系统
模拟与混合信号
嵌入式系统
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