Freescale Semiconductor, Inc.
Data Sheet: Technical Data
Document Number: KL17P64M48SF6
Rev. 6, 02/2016
Kinetis KL17 Microcontroller
48 MHz ARM® Cortex®-M0+ and 128/256 KB Flash
MKL17Z128Vxx4
MKL17Z256Vxx4
MKL17Z256CAL4R
The KL17 series is optimized for cost-sensitive and battery-
powered applications requiring low-power general-purpose
connectivity. The product offers:
• Embedded ROM with boot loader for flexible program
upgrade
• High accuracy internal voltage and clock reference
• FlexIO to support any standard and customized serial
peripheral emulation
• Down to 54uA/MHz in very low power run mode and
1.96uA in deep sleep mode (RAM + RTC retained)
32 and 48 QFN
36 WLCSP
5x5 mm P 0.5 mm 7x7
2.8x2.7 mm P 0.4 mm
mm P 0.5 mm
64 LQFP
10x10 mm P 0.5 mm
64 BGA
5x5 mm P 0.5 mm
Core Processor
• ARM
®
Cortex
®
-M0+ core up to 48 MHz
Memories
• 128/256 KB program flash memory
• 32 KB SRAM
• 16 KB ROM with build-in bootloader
• 32-byte backup register
System
• 4-channel asynchronous DMA controller
• Watchdog
• Low-leakage wakeup unit
• Two-pin Serial Wire Debug (SWD) programming and
debug interface
• Micro Trace Buffer
• Bit manipulation engine
• Interrupt controller
Clocks
• 48MHz high accuracy (up to 0.5%) internal reference
clock
• 8MHz/2MHz high accuracy (up to 3%) internal
reference clock
• 1KHz reference clock active under all low-power
modes (except VLLS0)
• 32–40KHz and 3–32MHz crystal oscillator
Peripherals
• One UART module supporting ISO7816, operating
up to 1.5 Mbit/s
• Two low-power UART modules supporting
asynchronous operation in low-power modes
• Two I2C modules and I2C0 supporting up to 1
Mbit/s
• Two 16-bit SPI modules supporting up to 24 Mbit/s
• One FlexIO module supporting emulation of
additional UART, IrDA, SPI, I2C, I2S, PWM and
other serial modules, etc.
• One serial audio interface I2S
• One 16-bit 818 ksps ADC module with high
accuracy internal voltage reference (Vref) and up to
16 channels
• High-speed analog comparator containing a 6-bit
DAC for programmable reference input
• One 12-bit DAC
• 1.2 V internal voltage reference
Timers
• One 6-channel Timer/PWM module
• Two 2-channel Timer/PWM modules
• One low-power timer
• Periodic interrupt timer
• Real time clock
© 2014–2016 Freescale Semiconductor, Inc. All rights reserved.
Operating Characteristics
Security and Integrity
• Voltage range: 1.71 to 3.6 V
• 80-bit unique identification number per chip
• Flash write voltage range: 1.71 to 3.6 V
• Advanced flash security
• Temperature range: –40 to 85 °C for WLCSP package
I/O
and –40 to 105 °C for other packages
• Up to 54 general-purpose input/output pins (GPIO)
Packages
and 6 high-drive pad
• 64 LQFP 10mm x 10mm, 0.5mm pitch, 1.6mm
Low Power
thickness
• Down to 54uA/MHz in very low power run mode
• 64 MAPBGA 5mm x 5mm, 0.5mm pitch, 1.23mm
• Down to 1.96uA in VLLS3 mode (RAM + RTC
thickness
retained)
• 48 QFN 7mm x 7mm, 0.5mm pitch, 0.65mm thickness
• Six flexible static modes
• 32 QFN 5mm x 5mm, 0.5mm pitch, 0.65mm thickness
• 36 WLCSP 2.8mm x 2.7mm, 0.4mm pitch, 0.6mm
thickness
Ordering Information
Product
Part number
Marking (Line1/
Line2)
M17P7V
M17P8V
M17P7V
M17P8V
MKL17Z128V//LH4
MKL17Z256V//LH4
M17P7V
M17P8V
MKL17Z256CAL4
Memory
Flash
(KB)
128
256
128
256
128
256
128
256
256
SRAM
(KB)
32
32
32
32
32
32
32
32
32
Package
Pin
count
32
32
48
48
64
64
64
64
36
Package
IO and ADC channel
GPIOs
GPIOs
(INT/HD)
1
19/6
19/6
24/6
24/6
31/6
31/6
31/6
31/6
23/6
ADC
channels
(SE/DP)
11/2
11/2
18/3
18/3
20/4
20/4
20/4
20/4
7/0
MKL17Z128VFM4
MKL17Z256VFM4
MKL17Z128VFT4
MKL17Z256VFT4
MKL17Z128VLH4
MKL17Z256VLH4
MKL17Z128VMP4
MKL17Z256VMP4
MKL17Z256CAL4R
QFN
QFN
QFN
QFN
LQFP
LQFP
MAPBGA
MAPBGA
WLCSP
28
28
40
40
54
54
54
54
26
1. INT: interrupt pin numbers; HD: high drive pin numbers
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Chip Errata
Description
The Freescale Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector.
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Resource
Solution Advisor
KL1XPB
1
KL17P64M48SF6RM
1
This document.
The chip mask set Errata provides additional or corrective information for KINETIS_L_1N71K
1
a particular device mask set.
Table continues on the next page...
2
Freescale Semiconductor, Inc.
Kinetis KL17 Microcontroller, Rev. 6, 02/2016
Related Resources (continued)
Type
Package
drawing
Description
Package dimensions are provided in package drawings.
Resource
64-LQFP: 98ASS23234W
1
64-
MAPBGA: 98ASA00420D
,
1
32-
QFN: 98ASA00615D
1
48-QFN:
98ASA00616D
,
1
36-WLCSP:
98ASA00949D
1
1. To find the associated resource, go to
http://www.nxp.com
and perform a search using this term.
Kinetis KL17 Microcontroller, Rev. 6, 02/2016
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1 Voltage and current operating requirements....... 7
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors..... 20
2.2.7 Designing with radiated emissions in mind..........21
2.2.8 Capacitance attributes.........................................21
2.3 Switching specifications...................................................21
2.3.1 Device clock specifications..................................21
2.3.2 General switching specifications......................... 22
2.4 Thermal specifications..................................................... 22
2.4.1 Thermal operating requirements......................... 22
2.4.2 Thermal attributes................................................23
3 Peripheral operating requirements and behaviors.................. 24
3.1 Core modules.................................................................. 24
3.1.1 SWD electricals .................................................. 24
3.2 System modules.............................................................. 25
3.3 Clock modules................................................................. 25
3.3.1 MCG-Lite specifications.......................................25
3.3.2 Oscillator electrical specifications........................27
3.4 Memories and memory interfaces................................... 29
3.4.1 Flash electrical specifications.............................. 29
3.5 Security and integrity modules........................................ 31
3.6 Analog............................................................................. 31
3.6.1
3.6.2
ADC electrical specifications............................... 31
Voltage reference electrical specifications.......... 36
3.6.3 CMP and 6-bit DAC electrical specifications....... 37
3.6.4 12-bit DAC electrical characteristics....................39
3.7 Timers..............................................................................42
3.8 Communication interfaces............................................... 42
3.8.1 SPI switching specifications................................ 42
3.8.2 I2C....................................................................... 47
3.8.3 UART...................................................................48
3.8.4 I2S/SAI switching specifications.......................... 49
Dimensions............................................................................. 53
4.1 Obtaining package dimensions....................................... 53
Pinouts and Packaging........................................................... 54
5.1 KL17 signal multiplexing and pin assignments................ 54
5.2 KL17 Family Pinouts........................................................57
5.3 Recommended connection for unused analog and
digital pins........................................................................61
Ordering parts......................................................................... 62
6.1 Determining valid orderable parts....................................62
Part identification.....................................................................62
7.1 Description.......................................................................62
7.2 Format............................................................................. 63
7.3 Fields............................................................................... 63
7.4 Example...........................................................................63
Terminology and guidelines.................................................... 64
8.1 Definitions........................................................................ 64
8.2 Examples......................................................................... 64
8.3 Typical-value conditions.................................................. 65
8.4 Relationship between ratings and operating
requirements....................................................................65
4
5
6
7
8
8.5 Guidelines for ratings and operating requirements..........66
9 Revision History...................................................................... 66
4
Freescale Semiconductor, Inc.
Kinetis KL17 Microcontroller, Rev. 6, 02/2016
Ratings
1 Ratings
1.1 Thermal handling ratings
Table 1. Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Table 2. Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Table 3. ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105 °C
Min.
–2000
–500
–100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
Kinetis KL17 Microcontroller, Rev. 6, 02/2016
5
Freescale Semiconductor, Inc.
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