Operational Amplifiers - Op Amps
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-8 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 放大器类型 | BUFFER |
| 最大平均偏置电流 (IIB) | 5 µA |
| 标称带宽 (3dB) | 330 MHz |
| 25C 时的最大偏置电流 (IIB) | 3 µA |
| 最大输入失调电压 | 3000 µV |
| JESD-30 代码 | R-GDIP-T8 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | -6 V |
| 标称负供电电压 (Vsup) | -5 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最小输出电流 | 0.1 A |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最小摆率 | 800 V/us |
| 标称压摆率 | 1300 V/us |
| 最大压摆率 | 14 mA |
| 供电电压上限 | 6 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MAX4178MJA | MAX4178EUA | MAX4278EUK-T | MAX4278ESA | MAX4278ESA+ | MAX4178EUK+T | MAX4178ESA | |
|---|---|---|---|---|---|---|---|
| 描述 | Operational Amplifiers - Op Amps | Precision Amplifiers | Operational Amplifiers - Op Amps | Operational Amplifiers - Op Amps | Operational Amplifiers - Op Amps | Precision Amplifiers | Precision Amplifiers |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | SOT-23 | SOIC | SOIC | SOT-23 | SOIC |
| 包装说明 | CERDIP-8 | MICRO, SOP-8 | SOT-23, 5 PIN | 0.150 INCH, SOIC-8 | 0.150 INCH, SOIC-8 | SOT-23, 5 PIN | 0.150 INCH, SOIC-8 |
| 针数 | 8 | 8 | 5 | 8 | 8 | 5 | 8 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | unknown | unknown | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 最大平均偏置电流 (IIB) | 5 µA | 5 µA | 5 µA | 5 µA | 5 µA | 5 µA | 5 µA |
| 标称带宽 (3dB) | 330 MHz | 330 MHz | 310 MHz | 310 MHz | 310 MHz | 330 MHz | 330 MHz |
| 25C 时的最大偏置电流 (IIB) | 3 µA | 3 µA | 3 µA | 3 µA | 3 µA | 3 µA | 3 µA |
| 最大输入失调电压 | 3000 µV | 3000 µV | 5000 µV | 3000 µV | 3000 µV | 5000 µV | 3000 µV |
| JESD-30 代码 | R-GDIP-T8 | S-PDSO-G8 | R-PDSO-G5 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G5 | R-PDSO-G8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e3 | e3 | e0 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 负供电电压上限 | -6 V | -6 V | -6 V | -6 V | -6 V | -6 V | -6 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 5 | 8 | 8 | 5 | 8 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最小输出电流 | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSSOP | LSSOP | SOP | SOP | LSSOP | SOP |
| 封装等效代码 | DIP8,.3 | TSSOP8,.19 | TSOP5/6,.11,37 | SOP8,.25 | SOP8,.25 | TSOP5/6,.11,37 | SOP8,.25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 260 | 260 | 240 |
| 电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.1 mm | 1.45 mm | 1.75 mm | 1.75 mm | 1.45 mm | 1.75 mm |
| 最小摆率 | 800 V/us | 800 V/us | 900 V/us | 1000 V/us | 1000 V/us | 800 V/us | 1000 V/us |
| 最大压摆率 | 14 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA |
| 供电电压上限 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | BIPOLAR | CMOS | CMOS | BIPOLAR | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin (Sn) | Tin (Sn) | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.65 mm | 0.95 mm | 1.27 mm | 1.27 mm | 0.95 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 30 | 30 | 20 |
| 宽度 | 7.62 mm | 3 mm | 1.625 mm | 3.9 mm | 3.9 mm | 1.625 mm | 3.9 mm |
| 标称压摆率 | 1300 V/us | 1300 V/us | 1600 V/us | 1600 V/us | 1600 V/us | - | 1300 V/us |
| Base Number Matches | 1 | - | - | 1 | 1 | - | 1 |
| 长度 | - | 3 mm | 2.9 mm | 4.9 mm | 4.9 mm | 2.9 mm | 4.9 mm |
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