Analog Switch ICs Quad SPST Anlg Swtch
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Vishay(威世) |
| 零件包装代码 | TSSOP |
| 包装说明 | SSOP, SSOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 正常位置 | NO |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 100 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长接通时间 | 200 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| DG308BDQ | DG308BDY | DG309BDJ | DG308BDJ | DG309BDJ-E3 | DG309BDY | DG308BDY-T1 | DG308BAK/883 | DG309BDY-E3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Analog Switch ICs Quad SPST Anlg Swtch | Analog Switch ICs SPST Analog Switch | Analog Switch ICs SPST Analog Switch | Analog Switch ICs SPST Analog Switch | Analog Switch ICs SPST Analog Switch | Analog Switch ICs SPST Analog Switch | Analog Switch ICs Quad Mono SPST | Analog Switch ICs Quad SPST Anlg Swtch | Analog Switch ICs SPST Analog Switch |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
| 厂商名称 | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) |
| 包装说明 | SSOP, SSOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-XDIP-T16 | R-PDSO-G16 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 正常位置 | NO | NO | NC | NO | NC | NC | NO | NO | NC |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 100 Ω | 200 Ω | 200 Ω | 200 Ω | 85 Ω | 200 Ω | 85 Ω | 200 Ω | 85 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | SSOP | SOP | DIP | DIP | DIP | SOP | SOP | DIP | SOP |
| 封装等效代码 | SSOP16,.25 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | SOP16,.25 | DIP16,.3 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15/12 V | +-15 V | +-15/12 V | +-15 V | +-15/12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | NO | NO | NO | YES | YES | NO | YES |
| 最长接通时间 | 200 ns | 300 ns | 300 ns | 300 ns | 200 ns | 300 ns | 200 ns | 300 ns | 200 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.635 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | - | 不符合 | - |
| 零件包装代码 | TSSOP | - | DIP | DIP | DIP | SOIC | SOIC | DIP | SOIC |
| 针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-609代码 | e0 | - | e0 | e0 | e3 | e0 | e0 | e0 | e3 |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
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