SMD291SNL15T4
Datasheet revision 1.1
www.chipquik.com
Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 15g T4 Mesh
Two Part Mix™ [PATENT PENDING]
Product Highlights
2 year shelf life unrefrigerated before mixed
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Specifications
Alloy:
Mesh Size:
Micron (µm) Range:
Flux Type:
Flux Classification:
Metal Load:
Melting Point:
Packaging:
Shelf Life:
Low voiding
Excellent wetting compatibility on most board finishes
Passes BONO test @1.56%
RoHS II and REACH compliant
Sn96.5/Ag3.0/Cu0.5
T4
20-38
Synthetic No-Clean
REL0
87% Metal by Weight
217-220°C (423-428°F)
2 compartment bag, includes Jar for after mixed storage, 15g
Before Mixed: Refrigerated >24 months, Unrefrigerated >24 months
After Mixed: Refrigerated >6 months, Unrefrigerated >2 months
How to Mix the Two Parts
This product MUST BE MIXED within its bag before use. To mix, squeeze the flux pocket towards the solder powder pocket
and the seal between the two compartments will break open, creating a single pocket bag. Then knead the mixture back and
forth for 2-3 minutes, or until a uniform consistency is achieved.
Printer Operation
Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Before Mixed: Store refrigerated or at room temperature 3-25°C (37-77°F). Do not freeze.
After Mixed: Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature
of 20-25°C (68-77°F) before use. Once mixed, the solder paste can be dispensed by cutting a small corner off the bag. It
can be resealed with a piece of Scotch® tape, or it can be stored by dispensing the entire bag into the provided empty jar.
Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
or air will not impact this product’s stated shelf life.
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© 1994-2017 Chip Quik® Inc.
Recommended Profile
Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization.
249°C (480°F)
217°C (423°F)
175°C (347°F)
Temperature
150°C (302°F)
25°C (77°F)
0sec
90sec
180sec
Time
210sec
240sec
270sec
Test Results
Test J-STD-004 or other
requirements as stated
Copper Mirror
Corrosion
Quantitative Halides
Electrochemical Migration
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Tack Value
Viscosity – Malcom @ 10 RPM/25°C
3
(x10 mPa/s)
Visual
Conflict Minerals Compliance
REACH Compliance
Test Requirement
IPC-TM-650: 2.3.32
IPC-TM-650: 2.6.15
IPC-TM-650: 2.3.28.1
IPC-TM-650: 2.6.14.1
IPC-TM-650: 2.6.3.7
IPC-TM-650: 2.4.44
IPC-TM-650: 2.4.34.4
IPC-TM-650: 3.4.2.5
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Result
L: No breakthrough
L: No corrosion
L: <0.5%
L: <1 decade drop (No-clean)
L: ≥100MΩ (No-clean)
64g
Print: 155-215, Dispense: 125-170
Clear and free from precipitation
Compliant
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
J-STD-005A (Solder Pastes):
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
Yes
Yes
Yes
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