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IS62C256AL-45ULI

产品描述SRAM 256K 32K x 8 45ns 5v Async SRAM 5v
产品类别存储    存储   
文件大小377KB,共12页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
标准
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IS62C256AL-45ULI概述

SRAM 256K 32K x 8 45ns 5v Async SRAM 5v

IS62C256AL-45ULI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称ISSI(芯成半导体)
零件包装代码SOIC
包装说明SOP, SOP28,.45
针数28
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time6 weeks
Samacsys DescriptionISSI, IS62C256AL-45ULI SRAM, 256kbit, 45ns, 5 28-Pin SOP
最长访问时间45 ns
I/O 类型COMMON
JESD-30 代码R-PDSO-G28
JESD-609代码e3
长度18.11 mm
内存密度262144 bit
内存集成电路类型STANDARD SRAM
内存宽度8
功能数量1
端子数量28
字数32768 words
字数代码32000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织32KX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP28,.45
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
座面最大高度2.84 mm
最大待机电流0.00002 A
最小待机电流2 V
最大压摆率0.025 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度8.405 mm
Base Number Matches1

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IS65C256AL
IS62C256AL
32K x 8 LOW POWER CMOS STATIC RAM
FEATURES
Access time: 25 ns, 45 ns
Low active power: 200 mW (typical)
Low standby power
— 150 µW (typical) CMOS standby
— 15 mW (typical) operating
Fully static operation: no clock or refresh
required
TTL compatible inputs and outputs
Single 5V power supply
Lead-free available
Industrial and Automotive temperatures available
JULY 2015
word by 8-bit CMOS static RAM. It is fabricated using
ISSI
's high-performance, low power CMOS technology.
DESCRIPTION
The
ISSI
IS62C256AL/IS65C256AL is a low power, 32,768
When
CE
is HIGH (deselected), the device assumes
a standby mode at which the power dissipation can be
reduced down to 150 µW (typical) at CMOS input levels.
Easy memory expansion is provided by using an active
LOW Chip Select (CE) input and an active LOW Output
Enable (OE) input. The active LOW Write Enable (WE)
controls both writing and reading of the memory.
The IS62C256AL/IS65C256AL is pin compatible with other
32Kx8 SRAMs in plastic SOP or TSOP (Type I) package.
FUNCTIONAL BLOCK DIAGRAM
A0-A14
DECODER
32K X 8
MEMORY ARRAY
VDD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE
OE
WE
CONTROL
CIRCUIT
Copyright © 2015 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause
failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written
assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
07/20/2015
1

IS62C256AL-45ULI相似产品对比

IS62C256AL-45ULI IS62C256AL-25ULI IS65C256AL-25ULA3-TR IS65C256AL-25TLA3 IS62C256AL-45TLI-TR
描述 SRAM 256K 32K x 8 45ns 5v Async SRAM 5v SRAM 256K (32K x 8) 25ns Async SRAM 5v SRAM 256K 32Kx8 25ns 5V Async SRAM SRAM 256K (32Kx8) 25ns 5V Async SRAM SRAM 256K 32K x 8 45ns 5v Async SRAM 5v
是否无铅 不含铅 不含铅 - 不含铅 -
是否Rohs认证 符合 符合 - 符合 -
零件包装代码 SOIC SOIC - TSOP -
包装说明 SOP, SOP28,.45 SOP, - TSOP1, TSSOP28,.53,22 -
针数 28 28 - 28 -
Reach Compliance Code compliant compliant - compliant -
ECCN代码 EAR99 EAR99 - EAR99 -
Factory Lead Time 6 weeks 6 weeks - 10 weeks -
最长访问时间 45 ns 25 ns - 25 ns -
JESD-30 代码 R-PDSO-G28 R-PDSO-G28 - R-PDSO-G28 -
JESD-609代码 e3 e3 - e3 -
长度 18.11 mm 18.11 mm - 11.8 mm -
内存密度 262144 bit 262144 bit - 262144 bit -
内存集成电路类型 STANDARD SRAM STANDARD SRAM - STANDARD SRAM -
内存宽度 8 8 - 8 -
功能数量 1 1 - 1 -
端子数量 28 28 - 28 -
字数 32768 words 32768 words - 32768 words -
字数代码 32000 32000 - 32000 -
工作模式 ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS -
最高工作温度 85 °C 85 °C - 125 °C -
最低工作温度 -40 °C -40 °C - -40 °C -
组织 32KX8 32KX8 - 32KX8 -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY -
封装代码 SOP SOP - TSOP1 -
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR -
封装形式 SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE -
并行/串行 PARALLEL PARALLEL - PARALLEL -
峰值回流温度(摄氏度) NOT SPECIFIED 260 - 260 -
认证状态 Not Qualified Not Qualified - Not Qualified -
座面最大高度 2.84 mm 2.84 mm - 1.2 mm -
最大供电电压 (Vsup) 5.5 V 5.5 V - 5.5 V -
最小供电电压 (Vsup) 4.5 V 4.5 V - 4.5 V -
标称供电电压 (Vsup) 5 V 5 V - 5 V -
表面贴装 YES YES - YES -
技术 CMOS CMOS - CMOS -
温度等级 INDUSTRIAL INDUSTRIAL - AUTOMOTIVE -
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - Matte Tin (Sn) - annealed -
端子形式 GULL WING GULL WING - GULL WING -
端子节距 1.27 mm 1.27 mm - 0.55 mm -
端子位置 DUAL DUAL - DUAL -
处于峰值回流温度下的最长时间 NOT SPECIFIED 40 - 40 -
宽度 8.405 mm 8.405 mm - 8 mm -
Base Number Matches 1 1 - 1 -

 
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