CMS09
TOSHIBA Schottky Barrier Rectifier
Schottky Barrier Type
CMS09
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
•
•
•
•
Forward voltage: V
FM
= 0.45 V (½ax)
Average forward current: I
F (AV)
= 1.0 A
Repetitive peak reverse voltage: V
RRM
= 30 V
Suitable for compact assembly due to small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Unit: mm
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
(Note 1)
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
30
1.0
(Ta
=
51°C)
25 (50 Hz)
−40~150
−40~150
Unit
V
A
A
°C
°C
Peak one cycle surge forward current
(non-repetitive)
Junction temperature
Storage temperature
JEDEC
JEITA
TOSHIBA
―
―
3-4E1A
Note 1: Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm, soldering land: 6 mm
×
6 mm)
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
V
FM (1)
Peak forward voltage
V
FM (2)
V
FM (3)
Repetitive peak reverse current
Junction capacitance
I
RRM
I
RRM
C
j
Test Condition
I
FM
=
0.1 A
I
FM
=
0.5 A
I
FM
=
1.0 A
V
RRM
=
5 V
V
RRM
=
30 V
V
R
=
10 V, f
=
1.0 MHz
Device mounted on a ceramic board
(soldering land: 2 mm
×
2 mm)
Thermal resistance
R
th (j-a)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm
×
6 mm)
⎯
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
0.32
0.37
0.40
1.5
15.0
70
⎯
⎯
⎯
Max
⎯
⎯
0.45
⎯
500
⎯
60
°C/W
135
16
°C/W
μA
pF
V
Unit
Thermal resistance
R
th (j-ℓ)
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2006-11-13
CMS09
Marking
Abbreviation Code
S9
Part No.
CMS09
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V
RRM
:
Use this rating with reference to the above. V
RRM
has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of I
F(AV)
and T
j
be below 120°C. When using this device, take the margin into consideration by
using an allowable Tamax-I
F(AV)
curve.
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a T
j
of below 120°C.
I
F(AV)
:
I
FSM
:
T
j
:
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2.1
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2006-11-13
CMS09
i
F
– v
F
10
0.6
Tj
=
150°C
125°C
P
F (AV)
– I
F (AV)
Average forward power dissipation
PF (AV) (W)
Rectangular
waveform
DC
0°
α
360°
Conduction angle:
α
α =
120°
iF (A)
0.5
Instantaneous forward current
0.4
α =
180°
1
75°C
25°C
0.3
α =
60°
0.2
0.1
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Instantaneous forward voltage vF
(V)
Average forward current
IF (AV) (A)
Ta max – I
F (AV)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm, land size 6 mm
×
6 mm)
160
160
Ta max – I
F (AV)
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
Maximum allowable ambient temperature
Ta max (°C)
140
DC
120
100
α =
60°
80
60
40
0°
α
360°
IF (AV)
20
Conduction angle:
α
VR
=
15 V
0
0
0.2
0.4
0.6
Rectangular
waveform
α =
180°
α =
120°
Maximum allowable ambient temperature
Ta max (°C)
140
120
100
α =
180°
80
60
40
α =
60°
20
0
0
0°
α
360°
IF (AV)
Conduction angle:
α
VR
=
15 V
0.6
0.8
1.0
1.2
1.4
1.6
α =
120°
Rectangular
waveform
DC
0.2
0.4
0.8
1.0
1.2
1.4
1.6
Average forward current
IF (AV) (A)
Average forward current
IF (AV) (A)
r
th (j-a)
– t
(°C/W)
500
Device mounted on a glass-epoxy board
Soldering land: 2.1 mm
×
1.4 mm
100
Transient thermal impedance r
th (j-a)
Device mounted on a glass-epoxy board
Soldering land: 6.0 mm
×
6.0 mm
10
Device mounted on a ceramic board
Soldering land: 2.0 mm
×
2.0 mm
1
0.5
0.001
0.01
0.1
1
10
100
1000
Time t (s)
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2006-11-13
CMS09
Surge forward current (non-repetitive)
28
C
j
– V
R
1000
(typ.)
f
=
1 MHz
Ta
=
25°C
I
FSM
(A)
24
20
16
12
8
4
0
1
Ta
=
25°C
f
=
50 Hz
Peak surge forward current
Junction capacitance
10
100
C
j
(pF)
100
Number of cycles
10
1
10
100
Reverse voltage
V
R
(V)
I
R
– T
j
100
Pulse test
(typ.)
0.8
P
R (AV)
– V
R
Rectangular waveform
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
60°
VR
α
300°
240°
180°
120°
(typ.)
Average reverse power dissipation
P
R (AV)
(W)
Reverse current I
R
(mA)
10
VR
=
30 V
0°
360°
DC
1
VR
=
20 V
VR
=
15 V
Conduction angle:
α
Tj
=
150°C
0.1
VR
=
3 V
0.01
VR
=
10 V
VR
=
5 V
0.001
0
20
40
60
80
100
120
140
160
10
20
30
Junction temperature T
j
(°C)
Reverse voltage
V
R
(V)
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2006-11-13
CMS09
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
20070701-EN
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
•
Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2006-11-13
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