CMH08A
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH08A
Switching Mode Power Supply Applications
Unit: mm
•
•
•
•
•
Repetitive peak reverse voltage: V
RRM
= 400 V
Average forward current: I
F (AV)
= 2.0 A
Low forward voltage: V
FM
=1.8 V(Max.)
Very Fast Reverse-Recovery Time: trr =35ns(Max.)
Suitable for compact assembly due to small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Peak one cycle surge forward current
(non-repetitive)
Junction temperature
Storage temperature range
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
400
2.0 (Note 1)
20 (50 Hz)
−40~150
−40~150
Unit
V
A
A
°C
°C
Note 1: Tℓ＝99°C Device mounted on a seramic board
board size: 50 mm
×
50 mm
soldering land: 2 mm
×2
mm
board thickness:0.64t
JEDEC
JEITA
―
―
Note 2: Using continuously under heavy loads (e.g. the application of
TOSHIBA
3-4E1A
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
Weight: 0.023 g (typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
V
FM (1)
Peak forward voltage
Peak repetitive reverse current
Reverse recovery time
Forward recovery time
V
FM (2)
V
FM (3)
I
RRM
t
rr
t
fr
Test Condition
I
FM
=
0.1 A (pulse test)
I
FM
=
1.0 A (pulse test)
I
FM
=
2.0 A (pulse test)
V
RRM
=
400 V (pulse test)
I
F
=
1 A, di/dt =
−30
A/μs
I
F
=
1.0 A
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
(soldering land: 2 mm
×
2 mm)
(board thickness: 0.64 t)
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 6 mm
×
6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 2.1 mm
×
1.4 mm)
(board thickness: 1.6 t)
Thermal resistance
(junction to lead)
R
th (j-ℓ)
⎯
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
0.88
1.3
1.6
⎯
⎯
⎯
⎯
Max
⎯
⎯
1.8
10
35
100
60
μA
ns
ns
V
Unit
⎯
⎯
135
°C/W
⎯
⎯
210
⎯
⎯
16
°C/W
1
2006-11-08
CMH08A
Marking
Type code
H8
Product No.
CMH08A
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
The absolute maximum ratings mean the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The followings are the general derating method that we recommend when you
design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient (0.1%/℃). Please consider this temperature coefficient when you design a
device at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV).
Please do the sufficient heat design. If you can’t design a circuit with excellent heat radiation, please set a margin
by using an allowable Tamax-IF (AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180°. Therefore,
this is only applied for an abnormal operation, which seldom occurs during device’s lifespan.
We recommend that a device be used Tj of below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on device’s mounting condition. When using a
device, please design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to Rectifier databook for further information.
2.1
2
2006-11-08
CMH08A
i
F
– v
F
100
P
F (AV)
– I
F (AV)
2.8
Rectangular
Waveform
Pulse test
i
F
(A)
Average forward power dissipation
P
F (AV)
(W)
2.4
0°
2.0
1.6
180°
360°
10
150°C
75°C
Instantaneous forward current
1
Tj
=
25°C
1.2
0.8
0.4
0
0
0.1
0.01
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.4
0.8
1.2
1.6
2.0
2.4
2.8
Instantaneous forward voltage v
F
(V)
Average forward current
I
F (AV)
(A)
Tℓ max – I
F (AV)
160
140
120
100
80
60
40
0°
20
0
0
180°
360°
0.2 0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0 2.2
Rectangular
Waveform
160
Ta max – I
F (AV)
Average allowable ambient temperature
Ta max (°C)
Device mounted on a glass-epoxy board:
board size: 50 mm
×
50 mm
Soldering land: 6.0 mm
×
6.0 mm
board thickness: 1.6 t
Maximum allowable lead temperature
Tℓ max (°C)
140
120
100
80
60
40
Rectangular
Waveform
0°
20
0
0
180°
360°
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Average forward current
I
F (AV)
(A)
Average forward current
I
F (AV)
(A)
r
th (j-a)
– t
1000
500
Device mounted on a glass-epoxy board:
board size: 50 mm
×
50 mm
Soldering land: 2.1 mm
×
1.4 mm
board thickness: 1.6 t
Transient thermal impedance
r
th (j-a)
(°C/W)
300
100
50
30
Device mounted on a glass-epoxy board:
board size: 50 mm
×
50 mm
Soldering land: 6.0 mm
×
6.0 mm
board thickness: 1.6 t
10
5
3
Device mounted on a ceramic board:
board size: 50 mm
×
50 mm
Soldering land: 2.0 mm
×
2.0 mm
board thickness: 0.64 t
0.003
0.01
0.03
0.1
0.3
1
3
1
0.001
10
30
100
300
1000
Time t (s)
3
2006-11-08
CMH08A
Surge forward current
(non-repetitive)
50
C
j
– V
R
100
(Typ.)
I
FSM
(A)
Ta
=
25°C
Ta
=
25°C
f
=
50 Hz
40
C
j
(pF)
50
30
f
=
1 MHz
Peak surge forward current
Junction capacitance
30
10
20
5
3
10
1
1
10
100
0
1
10
100
Reverse voltage
V
R
(V)
Number of cycles
4
2006-11-08
CMH08A
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
20070701-EN
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
•
Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
5
2006-11-08
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