16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | TSOP |
| 包装说明 | 10 X 20 MM, PLASTIC, TSOP-40 |
| 针数 | 40 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 11 ns |
| 命令用户界面 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-PDSO-G40 |
| JESD-609代码 | e0 |
| 长度 | 18.4 mm |
| 内存密度 | 16777216 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 部门数/规模 | 32 |
| 端子数量 | 40 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -20 °C |
| 组织 | 2MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装等效代码 | TSSOP40,.8,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 电源 | 3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 部门规模 | 64K |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.06 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 切换位 | NO |
| 类型 | NOR TYPE |
| 宽度 | 10 mm |
| Base Number Matches | 1 |
| M50FW016N5 | M50FW016N1 | M50FW016N1G | M50FW016N1TG | M50FW016N5G | M50FW016N5TG | M50FW016N5T | M50FW016N | M50FW016N1T | M50FW016 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | 16 Mbit 2Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | - | 不符合 | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | - |
| 零件包装代码 | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP | - | TSOP | - |
| 包装说明 | 10 X 20 MM, PLASTIC, TSOP-40 | 10 X 20 MM, PLASTIC, TSOP-40 | 10 X 20 MM, LEAD FREE, PLASTIC, TSOP-40 | 10 X 20 MM, LEAD FREE, PLASTIC, TSOP-40 | 10 X 20 MM, LEAD FREE, PLASTIC, TSOP-40 | 10 X 20 MM, LEAD FREE, PLASTIC, TSOP-40 | 10 X 20 MM, PLASTIC, TSOP-40 | - | 10 X 20 MM, PLASTIC, TSOP-40 | - |
| 针数 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | - | 40 | - |
| Reach Compliance Code | _compli | _compli | compli | compli | unknow | compli | _compli | - | _compli | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | - |
| Is Samacsys | N | - | - | N | N | N | N | - | N | - |
| 最长访问时间 | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | - | 11 ns | - |
| JESD-30 代码 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | - | R-PDSO-G40 | - |
| 长度 | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | - | 18.4 mm | - |
| 内存密度 | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | - | 16777216 bi | - |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | - | FLASH | - |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | - | 40 | - |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | - | 2097152 words | - |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | - | 2000000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | - |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | - | 70 °C | - |
| 组织 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | - | 2MX8 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
| 封装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | - | TSOP1 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | - |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | - |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | - |
| 温度等级 | OTHER | COMMERCIAL | COMMERCIAL | COMMERCIAL | OTHER | OTHER | OTHER | - | COMMERCIAL | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | - |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | - |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | - | 10 mm | - |
| Base Number Matches | 1 | - | - | 1 | 1 | 1 | 1 | - | 1 | - |
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