10-Bit Buffers And Bus Drivers 24-SOIC 0 to 70
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | PLASTIC, SO-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| Factory Lead Time | 1 week |
| Is Samacsys | N |
| 控制类型 | ENABLE LOW |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-PDSO-G24 |
| 长度 | 15.4 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.048 A |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 40 mA |
| Prop。Delay @ Nom-Sup | 15 ns |
| 传播延迟（tpd） | 5.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| SN74BCT29828BDW | SN74BCT29828BNT | SN54BCT29828BFK | SN54BCT29828BJT | |
|---|---|---|---|---|
| 描述 | 10-Bit Buffers And Bus Drivers 24-SOIC 0 to 70 | 10-Bit Buffers And Bus Drivers 24-PDIP 0 to 70 | BCT/FBT SERIES, 10-BIT DRIVER, INVERTED OUTPUT, CQCC28, CERAMIC, LCC-28 | BCT/FBT SERIES, 10-BIT DRIVER, INVERTED OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | DIP | QLCC | DIP |
| 包装说明 | PLASTIC, SO-24 | 0.300 INCH, PLASTIC, DIP-24 | QCCN, | DIP, |
| 针数 | 24 | 24 | 28 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT |
| JESD-30 代码 | R-PDSO-G24 | R-PDIP-T24 | S-CQCC-N28 | R-GDIP-T24 |
| 长度 | 15.4 mm | 31.64 mm | 11.43 mm | 32.005 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS TRANSCEIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 28 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | SOP | DIP | QCCN | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 传播延迟（tpd） | 5.9 ns | 5.9 ns | 6.3 ns | 6.3 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 5.08 mm | 2.03 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL |
| 宽度 | 7.5 mm | 7.62 mm | 11.43 mm | 7.62 mm |
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