REVISIONS
LTR
E
DESCRIPTION
Added device type 06 for vendor cages 54230 and 88379. Added
vendor cage 0EU86 for device types 01 through 06. Figure 1,
changed case outline M to reflect package is available in either a
single or dual cavity. -sld
Added case outline 9.
Added device types 07, 08, and 09 for vendor cage 0EU86. Made
changes to table I to include the addition of device types 07, 08, and
09. Added a min limit to the table I for the I
LI
, and the I
LO
tests. Made
changes to Figures 2, 3, 4, 5, 6, and 8. -sld
Added case outline Z. Updated paragraph 1.2.4, 1.3, figures 1, 2,
and 8. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
Updated drawing paragraphs. -sld
Paragraph 1.2.4 Case outline M: Correct case outline M package
style from “single/dual” to “dual”. Paragraph 1.2.4 footnote 1/: Delete
“(single cavity)” and “Case outline A can be used if longer leads are
necessary”. Figure 1 case outline M: Correct figure 1 to reflect dual
cavity quad flatpack only for case outline M. -gc
DATE (YR-MO-DA)
99-05-14
APPROVED
K. A. Cottongim
F
G
00-04-06
02-01-31
Raymond Monnin
Raymond Monnin
H
J
K
L
02-06-04
03-10-06
12-04-16
12-08-16
Raymond Monnin
Raymond Monnin
Charles F. Saffle
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
L
35
L
15
L
36
L
16
L
17
L
18
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Michael C. Jones
L
19
L
20
L
21
L
1
L
22
L
2
L
23
L
3
L
24
L
4
L
25
L
5
L
26
L
6
L
27
L
7
L
28
L
8
L
29
L
9
L
30
L
10
L
31
L
11
L
32
L
12
L
33
L
13
L
34
L
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, 128K x 32-BIT, ELECTRICALLY
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY
DRAWING APPROVAL DATE
94-08-02
REVISION LEVEL
L
SIZE
A
SHEET
CAGE CODE
67268
1 OF
36
5962-94585
DSCC FORM 2233
APR 97
5962-E441-12
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
Generic number
128K32-300
128K32-250
128K32-200
128K32-150
128K32-140
128K32-120
128K32-250
128K32-200
128K32-150
Circuit function
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
Access time
300 ns
250 ns
200 ns
150 ns
140 ns
120 ns
250 ns
200 ns
150 ns
94585
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
M
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
H
G
E
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-94585
SHEET
2
DSCC FORM 2234
APR 97
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
B
M 1/
N
T
U
X
Y
4
5
6
9 1/
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
68
66
66
66
66
66
66
66
68
68
Package style
Ceramic, single cavity, quad flatpack
Ceramic, dual cavity, quad flatpack
Ceramic, single cavity, quad flatpack
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
Ceramic, single cavity, quad flatpack
Ceramic, dual cavity, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V
CC
) ........................................................
Input voltage range ....................................................................
Power dissipation (P
D
) ...............................................................
Storage temperature range ........................................................
Lead temperature (soldering, 10 seconds) ................................
Thermal resistance junction-to-case (θ
JC
):
Case outlines T, X, U, and Y ..................................................
Case outline M and Z .............................................................
Case outline N ........................................................................
Case outlines 4, 5, and 6 ........................................................
Case outline B and 9 ..............................................................
Data retention ............................................................................
Endurance .................................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ........................................................
Input low voltage range (V
IL
) ......................................................
Input high voltage range (V
IH
):
Device types 01 through 06 ....................................................
Device types 07 through 09 ....................................................
Output voltage, High minimum (V
OH
) .........................................
Output voltage, low maximum (V
OL
) ...........................................
Case operating temperature range (T
C
) .....................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to V
CC
+ 0.3 V dc
+2.2 V dc to V
CC
+ 0.3 V dc
+2.4 V dc
+0.45 V dc
-55°C to +125°C
-0.6 V to +6.25 V
-0.6 V to +6.25 V
1.4 W
-65°C to +150°C
+300°C
6.2°C/W
9.4°C/W
3.1°C/W
2.7°C/W
1.79°C/W
10 years minimum
10,000 cycles minimum 3/
1/
2/
3/
Due to the short leads of case outline M and case outline 9, caution should be taken if the system
application is to be used where extreme thermal transitions can occur.
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Device types 7 through 9 for page mode writes only.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-94585
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, 6, and 7.
3.2.5 Block diagram. The block diagram shall be as specified on figure 8.
3.2.5 Typical output test circuit. The typical output test circuit shall be as specified on figure 9.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-94585
SHEET
4
DSCC FORM 2234
APR 97
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Programming procedure. The programming procedure shall be as specified by manufacturer and shall be available on
request.
3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked as listed in MIL-HDBK-103
and QML-38534.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for the initial characterization and after any design or process changes which may affect
the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full specified operating temperature range. The vendor's
procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design or process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-94585
SHEET
5
DSCC FORM 2234
APR 97
PCB设计
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