IC 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20, Microcontroller
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP20,.4 |
针数 | 20 |
Reach Compliance Code | unknown |
Is Samacsys | N |
具有ADC | NO |
其他特性 | OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ |
地址总线宽度 | |
位大小 | 8 |
CPU系列 | 8051 |
最大时钟频率 | 20 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e4 |
长度 | 12.8 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 18 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
电源 | 3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 128 |
ROM(单词) | 4096 |
ROM可编程性 | OTPROM |
座面最大高度 | 2.65 mm |
速度 | 20 MHz |
最大压摆率 | 25 mA |
最大供电电压 | 6 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.5 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Base Number Matches | 1 |
P87LPC764FD | P87LPC764BDH | P87LPC764BD | P87LPC764BN | P87LPC764FN | P87LPC764HDH,529 | |
---|---|---|---|---|---|---|
描述 | IC 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20, Microcontroller | 8-BIT, OTPROM, 20MHz, MICROCONTROLLER, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 | 8-BIT, OTPROM, 20MHz, MICROCONTROLLER, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 | IC 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDIP20, 0.300 INCH, PLASTIC, MS-001, SOT-146-1, DIP-20, Microcontroller | IC 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDIP20, 0.300 INCH, PLASTIC, MS-001, SOT-146-1, DIP-20, Microcontroller | P87LPC764HDH |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | SOP, SOP20,.4 | 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 | 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 | 0.300 INCH, PLASTIC, MS-001, SOT-146-1, DIP-20 | 0.300 INCH, PLASTIC, MS-001, SOT-146-1, DIP-20 | 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 |
Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
零件包装代码 | SOIC | TSSOP | SOIC | DIP | DIP | - |
针数 | 20 | 20 | 20 | 20 | 20 | - |
Is Samacsys | N | N | N | N | N | - |
具有ADC | NO | NO | NO | NO | NO | - |
其他特性 | OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ | - |
位大小 | 8 | 8 | 8 | 8 | 8 | - |
CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | - |
最大时钟频率 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | - |
DAC 通道 | NO | NO | NO | NO | NO | - |
DMA 通道 | NO | NO | NO | NO | NO | - |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | - |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - |
长度 | 12.8 mm | 6.5 mm | 12.8 mm | 26.73 mm | 26.73 mm | - |
I/O 线路数量 | 18 | 18 | 18 | 18 | 18 | - |
端子数量 | 20 | 20 | 20 | 20 | 20 | - |
最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | - |
PWM 通道 | NO | NO | NO | NO | NO | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | SOP | TSSOP | SOP | DIP | DIP | - |
封装等效代码 | SOP20,.4 | TSSOP20,.25 | SOP20,.4 | DIP20,.3 | DIP20,.3 | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | IN-LINE | - |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | - |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
RAM(字节) | 128 | 128 | 128 | 128 | 128 | - |
ROM(单词) | 4096 | 4096 | 4096 | 4096 | 4096 | - |
ROM可编程性 | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | - |
座面最大高度 | 2.65 mm | 1.1 mm | 2.65 mm | 4.2 mm | 4.2 mm | - |
速度 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | - |
最大压摆率 | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | - |
最大供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V | - |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | - |
表面贴装 | YES | YES | YES | NO | NO | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | - |
端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - |
端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - |
端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 7.5 mm | 4.4 mm | 7.5 mm | 7.62 mm | 7.62 mm | - |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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