Standard SRAM, 64KX16, 100ns, CMOS, PBGA48
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | _compli |
| 最长访问时间 | 100 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PBGA-B48 |
| JESD-609代码 | e0 |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 端子数量 | 48 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA48,6X8,30 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 225 |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.000005 A |
| 最小待机电流 | 1.5 V |
| 最大压摆率 | 0.035 mA |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL |
| 端子节距 | 0.75 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| IDT71L016L100BF | IDT71L016L100BFI | IDT71L016L70BFI | IDT71L016L70BF | 71L016L70BF | 71L016L70BFI | 71L016L70PHI | 71L016L70PH | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 64KX16, 100ns, CMOS, PBGA48 | Standard SRAM, 64KX16, 100ns, CMOS, PBGA48 | Standard SRAM, 64KX16, 70ns, CMOS, PBGA48 | Standard SRAM, 64KX16, 70ns, CMOS, PBGA48 | Standard SRAM, 64KX16, 70ns, CMOS, PBGA46, 7 X 9 MM, 1.40 MM HEIGHT, 0.75 MM PITCH, FPBGA-46 | Standard SRAM, 64KX16, 70ns, CMOS, PBGA46, 7 X 9 MM, 1.40 MM HEIGHT, 0.75 MM PITCH, FPBGA-46 | Standard SRAM, 64KX16, 70ns, CMOS, PDSO44, 0.400 INCH, MS-024AC, TSOP2-44 | Standard SRAM, 64KX16, 70ns, CMOS, PDSO44, 0.400 INCH, MS-024AC, TSOP2-44 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | _compli | _compli | _compli | _compli | _compli | _compli | _compli | _compli |
| 最长访问时间 | 100 ns | 100 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B46 | R-PBGA-B46 | R-PDSO-G44 | R-PDSO-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 48 | 48 | 48 | 48 | 46 | 46 | 44 | 44 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | FBGA | FBGA | LFBGA | LFBGA | TSOP2 | TSOP2 |
| 封装等效代码 | BGA48,6X8,30 | BGA48,6X8,30 | BGA48,6X8,30 | BGA48,6X8,30 | BGA48,6X8,30 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.000005 A | 0.00001 A | 0.00001 A | 0.000005 A | 0.000005 A | 0.00001 A | 0.000005 A | 0.000005 A |
| 最小待机电流 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 最大压摆率 | 0.035 mA | 0.035 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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