FIFO, 512X9, 65ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | QFJ |
| 包装说明 | QCCJ, LDCC32,.5X.6 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 65 ns |
| 周期时间 | 80 ns |
| JESD-30 代码 | R-PQCC-J32 |
| JESD-609代码 | e0 |
| 长度 | 13.97 mm |
| 内存密度 | 4608 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512X9 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.556 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |
| 67C4501-65NL | 67C4501-35N | 67C4501-35J | 67C4501-50J | 67C4501-50NL | 67C4501-65J | 67C4501-65N | 67C4501-80J | 67C4501-80N | 67C4501-80NL | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 512X9, 65ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | FIFO, 512X9, 35ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 | FIFO, 512X9, 35ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 50ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | FIFO, 512X9, 65ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 65ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 | FIFO, 512X9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 80ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 | FIFO, 512X9, 80ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | QFJ | DIP | DIP | DIP | QFJ | DIP | DIP | DIP | DIP | QFJ |
| 包装说明 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 |
| 针数 | 32 | 28 | 28 | 28 | 32 | 28 | 28 | 28 | 28 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 65 ns | 35 ns | 35 ns | 50 ns | 50 ns | 65 ns | 65 ns | 80 ns | 80 ns | 80 ns |
| 周期时间 | 80 ns | 45 ns | 45 ns | 65 ns | 65 ns | 80 ns | 80 ns | 100 ns | 100 ns | 100 ns |
| JESD-30 代码 | R-PQCC-J32 | R-PDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-PQCC-J32 | R-GDIP-T28 | R-PDIP-T28 | R-GDIP-T28 | R-PDIP-T28 | R-PQCC-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 13.97 mm | 37.084 mm | 37.1475 mm | 37.1475 mm | 13.97 mm | 37.1475 mm | 37.084 mm | 37.1475 mm | 37.084 mm | 13.97 mm |
| 内存密度 | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 28 | 28 | 28 | 32 | 28 | 28 | 28 | 28 | 32 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP | DIP | QCCJ | DIP | DIP | DIP | DIP | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.556 mm | 5.715 mm | 5.588 mm | 5.588 mm | 3.556 mm | 5.588 mm | 5.715 mm | 5.588 mm | 5.715 mm | 3.556 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 11.43 mm | 15.24 mm | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 11.43 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Is Samacsys | N | - | N | N | N | N | N | N | N | N |
DSP 与 ARM 处理器
模拟电子
国产芯片交流
单片机
嵌入式系统
模拟与混合信号
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
