Datasheet> 器件分类 > 存储> IDT71V016SA20BFI8

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IDT71V016SA20BFI8: 产品描述Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48; 产品类别存储; 文件大小99KB，共9页; 制造商IDT (Integrated Device Technology)

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IDT71V016SA20BFI8概述

Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48

IDT71V016SA20BFI8规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	LFBGA, BGA48,6X8,30
针数	48
Reach Compliance Code	not_compliant
ECCN代码	3A991.B.2.A
最长访问时间	20 ns
I/O 类型	COMMON
JESD-30 代码	S-PBGA-B48
JESD-609代码	e0
长度	7 mm
内存密度	1048576 bit
内存集成电路类型	STANDARD SRAM
内存宽度	16
湿度敏感等级	3
功能数量	1
端子数量	48
字数	65536 words
字数代码	64000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	64KX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	LFBGA
封装等效代码	BGA48,6X8,30
封装形状	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
电源	3.3 V
认证状态	Not Qualified
座面最大高度	1.34 mm
最大待机电流	0.01 A
最小待机电流	3.15 V
最大压摆率	0.12 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn63Pb37)
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	20
宽度	7 mm
Base Number Matches	1

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3.3V CMOS Static RAM

1 Meg (64K x 16-Bit)

Features

IDT71V016SA

Description

The IDT71V016 is a 1,048,576-bit high-speed Static RAM organized

as 64K x 16. It is fabricated using IDT’s high-perfomance, high-reliability

CMOS technology. This state-of-the-art technology, combined with inno-

vative circuit design techniques, provides a cost-effective solution for high-

speed memory needs.

The IDT71V016 has an output enable pin which operates as fast

as 5ns, with address access times as fast as 10ns. All bidirectional

inputs and outputs of the IDT71V016 are LVTTL-compatible and operation

is from a single 3.3V supply. Fully static asynchronous circuitry is used,

requiring no clocks or refresh for operation.

The IDT71V016 is packaged in a JEDEC standard 44-pin Plastic

SOJ, a 44-pin TSOP Type II, and a 48-ball plastic 7 x 7 mm FBGA.

64K x 16 advanced high-speed CMOS Static RAM

Equal access and cycle times

— Commercial: 10/12/15/20ns

— Industrial: 12/15/20ns

One Chip Select plus one Output Enable pin

Bidirectional data inputs and outputs directly

LVTTL-compatible

Low power consumption via chip deselect

Upper and Lower Byte Enable Pins

Single 3.3V power supply

Available in 44-pin Plastic SOJ, 44-pin TSOP, and

48-Ball Plastic FBGA packages

Functional Block Diagram

Output

Enable

Buffer

– A

Address

Buffers

Row / Column

Decoders

I/O

Chip

Enable

Buffer

Sense

Amps

and

Write

Drivers

Low

Byte

I/O

Buffer

High

Byte

I/O

Buffer

I/O

Write

Enable

Buffer

64K x 16

Memory

Array

I/O

BHE

Byte

Enable

Buffers

BLE

3834 drw 01

JUNE 2002

DSC-3834/06

IDT71V016SA20BFI8相似产品对比

	IDT71V016SA20BFI8	IDT71V016SA15BF8	IDT71V016SA20BF8	IDT71V016SA10BF8	IDT71V016SA15BFI8	IDT71V016SA12BF8	IDT71V016SA12BFI8
描述	Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 15ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 10ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 15ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48	Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30
针数	48	48	48	48	48	48	48
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	20 ns	15 ns	20 ns	10 ns	15 ns	12 ns	12 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48
JESD-609代码	e0	e0	e0	e0	e0	e0	e0
长度	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	16	16	16	16	16	16	16
湿度敏感等级	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1
端子数量	48	48	48	48	48	48	48
字数	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
字数代码	64000	64000	64000	64000	64000	64000	64000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	70 °C	70 °C	70 °C	85 °C	70 °C	85 °C
组织	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
封装等效代码	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	225	225	225	225	225	225	225
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.34 mm	1.34 mm	1.34 mm	1.34 mm	1.34 mm	1.34 mm	1.34 mm
最大待机电流	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A
最小待机电流	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
最大压摆率	0.12 mA	0.13 mA	0.12 mA	0.16 mA	0.13 mA	0.15 mA	0.16 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3.15 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	20	20	20	20	20	20	20
宽度	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Base Number Matches	1	1	1	1	1	-	-

IDT71V016SA20BFI8

IDT71V016SA20BFI8概述

IDT71V016SA20BFI8规格参数

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