Dual-Port SRAM, 4KX9, 25ns, CMOS, PQCC52, 0.75 X 0.75 MM, 0.17 MM INCH HEIGHT, GREEN, PLASTIC, LCC-52
| 参数名称 | 属性值 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 包装说明 | QCCJ, |
| Reach Compliance Code | compliant |
| 最长访问时间 | 25 ns |
| JESD-30 代码 | S-PQCC-J52 |
| JESD-609代码 | e3 |
| 长度 | 19.1262 mm |
| 内存密度 | 36864 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 52 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4KX9 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 19.1262 mm |
| Base Number Matches | 1 |

| 7014S25JG8 | 7014S15PFG8 | 7014S20JGI8 | 7014S20JG8 | 7014S20PFGI8 | 7014S20PFG8 | 7014S25PFG8 | 7014S15JG8 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 4KX9, 25ns, CMOS, PQCC52, 0.75 X 0.75 MM, 0.17 MM INCH HEIGHT, GREEN, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX9, 15ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64 | Dual-Port SRAM, 8KX9, 20ns, CMOS, PQCC68, 0.95 X 0.95 INCH, 0.17 INCH HEIGHT, GREEN, PLASTIC, LCC-68 | Dual-Port SRAM, 4KX9, 20ns, CMOS, PQCC52, 0.75 X 0.75 MM, 0.17 MM INCH HEIGHT, GREEN, PLASTIC, LCC-52 | Dual-Port SRAM, 8KX9, 20ns, CMOS, PQFP80, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-80 | Dual-Port SRAM, 4KX9, 20ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64 | Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64 | Dual-Port SRAM, 4KX9, 15ns, CMOS, PQCC52, 0.75 X 0.75 MM, 0.17 MM INCH HEIGHT, GREEN, PLASTIC, LCC-52 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 包装说明 | QCCJ, | LQFP, | QCCJ, | QCCJ, | LQFP, | LQFP, | LQFP, | QCCJ, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 25 ns | 15 ns | 20 ns | 20 ns | 20 ns | 20 ns | 25 ns | 15 ns |
| JESD-30 代码 | S-PQCC-J52 | S-PQFP-G64 | S-PQCC-J68 | S-PQCC-J52 | S-PQFP-G80 | S-PQFP-G64 | S-PQFP-G64 | S-PQCC-J52 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 19.1262 mm | 14 mm | 24.2062 mm | 19.1262 mm | 14 mm | 14 mm | 14 mm | 19.1262 mm |
| 内存密度 | 36864 bit | 36864 bit | 73728 bit | 36864 bit | 73728 bit | 36864 bit | 36864 bit | 36864 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 64 | 68 | 52 | 80 | 64 | 64 | 52 |
| 字数 | 4096 words | 4096 words | 8192 words | 4096 words | 8192 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 8000 | 4000 | 8000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4KX9 | 4KX9 | 8KX9 | 4KX9 | 8KX9 | 4KX9 | 4KX9 | 4KX9 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | LQFP | QCCJ | QCCJ | LQFP | LQFP | LQFP | QCCJ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | FLATPACK, LOW PROFILE | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 座面最大高度 | 4.57 mm | 1.6 mm | 4.57 mm | 4.57 mm | 1.6 mm | 1.6 mm | 1.6 mm | 4.57 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | J BEND | GULL WING | J BEND | J BEND | GULL WING | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.8 mm | 0.8 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 19.1262 mm | 14 mm | 24.2062 mm | 19.1262 mm | 14 mm | 14 mm | 14 mm | 19.1262 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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