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IDT72T36135ML6BBGI

产品描述FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240
产品类别存储   
文件大小485KB,共48页
制造商IDT (Integrated Device Technology)
标准  
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IDT72T36135ML6BBGI概述

FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240

IDT72T36135ML6BBGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA240,18X18,40
针数240
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间3.8 ns
最大时钟频率 (fCLK)166 MHz
周期时间6 ns
JESD-30 代码S-PBGA-B240
JESD-609代码e1
长度19 mm
内存密度18874368 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量240
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA240,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源2.5 V
认证状态Not Qualified
座面最大高度1.76 mm
最大待机电流0.14 A
最大压摆率0.18 mA
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
Base Number Matches1

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2.5V 18M-BIT HIGH-SPEED TeraSync
TM
FIFO 36-BIT CONFIGURATIONS
524,288 x 36
IDT72T36135M
FEATURES:
Industry’s largest FIFO memory organization:
IDT72T36135
524,288 x 36 - 18M-bits
Up to 200 MHz Operation of Clocks
Functionally and pin compatible to 9Mbit IDT72T36125 TeraSync
devices
User selectable HSTL/LVTTL Input and/or Output
User selectable Asynchronous read and/or write port timing
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input disables Write Port
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty and Full flags signal FIFO status
Select IDT Standard timing (using
EF[1:2]
and
FF[1:2]
flags) or First
Word Fall Through timing (using
OR[1:2]
and
IR[1:2]
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 240-pin (19mm x 19mm)Plastic Ball Grid Array (PBGA)
50% more space saving than the leading 9M-bit FIFOs
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
D
0
-D
n
(x36)
WEN
WCLK/WR
WCS
LD
SEN
SCLK
INPUT REGISTER
OFFSET REGISTER
FF/IR[1:2]
PAF[1:2]
EF/OR[1:2]
PAE[1:2]
FWFT/SI
PFM
FSEL0
FSEL1
ASYW
WRITE CONTROL
LOGIC
FLAG
LOGIC
RAM ARRAY
524,288 x 36
READ POINTER
WRITE POINTER
MRS
PRS
TCK
TRST
TMS
TDO
TDI
Vref
WHSTL
RHSTL
SHSTL
RESET
LOGIC
JTAG CONTROL
(BOUNDARY
SCAN)
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MARK
ASYR
HSTL I/0
CONTROL
RCLK/RD
REN
RCS
OE
6723 drw01
Q
0
-Q
n
(x36)
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
MAY 2006
DSC-6723/3

 
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