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IDT7188S70DB

产品描述Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
产品类别存储   
文件大小69KB,共7页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT7188S70DB概述

Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22

IDT7188S70DB规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码DIP
包装说明0.300 INCH, CERAMIC, DIP-22
针数22
Reach Compliance Codenot_compliant
ECCN代码3A001.A.2.C
最长访问时间70 ns
I/O 类型COMMON
JESD-30 代码R-GDIP-T22
JESD-609代码e0
长度27.051 mm
内存密度65536 bit
内存集成电路类型STANDARD SRAM
内存宽度4
功能数量1
端口数量1
端子数量22
字数16384 words
字数代码16000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织16KX4
输出特性3-STATE
可输出NO
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装等效代码DIP22,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源5 V
认证状态Not Qualified
筛选级别MIL-STD-883 Class B
座面最大高度5.08 mm
最大待机电流0.02 A
最小待机电流4.5 V
最大压摆率0.14 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间20
宽度7.62 mm
Base Number Matches1

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CMOS STATIC RAM
64K (16K x 4-BIT)
Integrated Device Technology, Inc.
IDT7188S
IDT7188L
FEATURES:
• High-speed (equal access and cycle times)
— Military: 25/35/45/55/70/85ns (max.)
• Low power consumption
• Battery backup operation — 2V data retention (L version
only)
• Available in high-density industry standard 22-pin, 300
mil ceramic DIP
• Produced with advanced CMOS technology
• Inputs/outputs TTL-compatible
• Military product compliant to MIL-STD-883, Class B
DESCRIPTION:
The IDT7188 is a 65,536-bit high-speed static RAM
organized as 16K x 4. It is fabricated using IDT’s high-
performance, high-reliability technology — CMOS. This state-
of-the-art technology, combined with innovative circuit design
techniques, provides a cost effective approach for memory
intensive applications.
Access times as fast as 25ns are available. The IDT7188
offers a reduced power standby mode, I
SB1
, which is activated
when
CS
goes HIGH. This capability significantly decreases
power while enhancing system reliability. The low-power
version (L) version also offers a battery backup data retention
capability where the circuit typically consumes only 30µW
operating from a 2V battery.
All inputs and outputs are TTL-compatible and operate
from a single 5V supply. The IDT7188 is packaged in 22-pin,
300 mil ceramic DIP providing excellent board-level packing
densities.
Military grade product is manufactured in compliance with
the latest revision of MIL-STD-883, Class B, making it ideally
suited to military temperature applications demanding the
highest level of performance and reliability.
FUNCTIONAL BLOCK DIAGRAM
A
0
V
CC
GND
65,536-BIT
MEMORY ARRAY
DECODER
A
13
I/O
0
I/O
1
I/O
2
I/O
3
COLUMN I/O
INPUT
DATA
CONTROL
CS
WE
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
2989 drw 01
MILITARY TEMPERATURE RANGE
©1996
Integrated Device Technology, Inc.
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
AUGUST 1996
6.3
DSC-2989/7
1

IDT7188S70DB相似产品对比

IDT7188S70DB IDT7188L35DB IDT7188S45DB IDT7188S55DB IDT7188L55DB
描述 Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
是否Rohs认证 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP DIP DIP DIP DIP
包装说明 0.300 INCH, CERAMIC, DIP-22 0.300 INCH, CERAMIC, DIP-22 DIP, DIP22,.3 DIP, DIP22,.3 DIP, DIP22,.3
针数 22 22 22 22 22
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
最长访问时间 70 ns 35 ns - 55 ns 55 ns
I/O 类型 COMMON COMMON - COMMON COMMON
JESD-30 代码 R-GDIP-T22 R-GDIP-T22 - R-GDIP-T22 R-GDIP-T22
JESD-609代码 e0 e0 - e0 e0
长度 27.051 mm 27.051 mm - 27.051 mm 27.051 mm
内存密度 65536 bit 65536 bit - 65536 bit 65536 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM - STANDARD SRAM STANDARD SRAM
内存宽度 4 4 - 4 4
功能数量 1 1 - 1 1
端口数量 1 1 - 1 1
端子数量 22 22 - 22 22
字数 16384 words 16384 words - 16384 words 16384 words
字数代码 16000 16000 - 16000 16000
工作模式 ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C - 125 °C 125 °C
最低工作温度 -55 °C -55 °C - -55 °C -55 °C
组织 16KX4 16KX4 - 16KX4 16KX4
输出特性 3-STATE 3-STATE - 3-STATE 3-STATE
可输出 NO NO - NO NO
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 DIP DIP - DIP DIP
封装等效代码 DIP22,.3 DIP22,.3 - DIP22,.3 DIP22,.3
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE - IN-LINE IN-LINE
并行/串行 PARALLEL PARALLEL - PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 - 225 225
电源 5 V 5 V - 5 V 5 V
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified
筛选级别 MIL-STD-883 Class B MIL-STD-883 Class B - MIL-STD-883 Class B MIL-STD-883 Class B
座面最大高度 5.08 mm 5.08 mm - 5.08 mm 5.08 mm
最大待机电流 0.02 A 0.0006 A - 0.02 A 0.0006 A
最小待机电流 4.5 V 2 V - 4.5 V 2 V
最大压摆率 0.14 mA 0.115 mA - 0.14 mA 0.11 mA
最大供电电压 (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V - 5 V 5 V
表面贴装 NO NO - NO NO
技术 CMOS CMOS - CMOS CMOS
温度等级 MILITARY MILITARY - MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm - 2.54 mm 2.54 mm
端子位置 DUAL DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 20 20 - 20 20
宽度 7.62 mm 7.62 mm - 7.62 mm 7.62 mm
Base Number Matches 1 1 1 1 -
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