OTP ROM, 1KX8, 30ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 30 ns |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.877 mm |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大待机电流 | 0.12 A |
| 最大压摆率 | 0.12 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8765103LA | 5962-8765102LA | CY7C281A-30JCR | CY7C281A-45JCR | 5962-8765102KA | CY7C281A-45JCT | CY7C281A-30JCT | CY7C281A-25JCR | |
|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 1KX8, 30ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | OTP ROM, 1KX8, 30ns, CMOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 1KX8, 45ns, CMOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 1KX8, 45ns, CMOS, CDFP24, CERPACK-24 | OTP ROM, 1KX8, 45ns, CMOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 1KX8, 30ns, CMOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 1KX8, 25ns, CMOS, PQCC28, PLASTIC, LCC-28 |
| 零件包装代码 | DIP | DIP | QLCC | QLCC | DFP | QLCC | QLCC | QLCC |
| 包装说明 | DIP, DIP24,.3 | DIP, | QCCJ, | QCCJ, | DFP, | QCCJ, | QCCJ, | QCCJ, |
| 针数 | 24 | 24 | 28 | 28 | 24 | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 30 ns | 45 ns | 30 ns | 45 ns | 45 ns | 45 ns | 30 ns | 25 ns |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | R-GDFP-F24 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 |
| 内存密度 | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 28 | 28 | 24 | 28 | 28 | 28 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | QCCJ | DFP | QCCJ | QCCJ | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | FLAT | J BEND | J BEND | J BEND |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | QUAD |
| 厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | - | Cypress(赛普拉斯) | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 长度 | 31.877 mm | 31.877 mm | - | - | 15.367 mm | 11.5316 mm | 11.5316 mm | - |
| 座面最大高度 | 5.08 mm | 5.08 mm | - | - | 2.286 mm | 4.572 mm | 4.572 mm | - |
| 端子节距 | 2.54 mm | 2.54 mm | - | - | 1.27 mm | 1.27 mm | 1.27 mm | - |
| 宽度 | 7.62 mm | 7.62 mm | - | - | 9.652 mm | 11.5316 mm | 11.5316 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
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