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IS62LV12816ALL-10B: 产品描述Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48; 产品类别存储; 文件大小83KB，共10页; 制造商Integrated Silicon Solution ( ISSI )

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IS62LV12816ALL-10B概述

Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48

IS62LV12816ALL-10B规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Integrated Silicon Solution ( ISSI )
零件包装代码	BGA
包装说明	6 X 8 MM, MINI, BGA-48
针数	48
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	100 ns
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B48
JESD-609代码	e0
长度	8 mm
内存密度	2097152 bit
内存集成电路类型	STANDARD SRAM
内存宽度	16
湿度敏感等级	3
功能数量	1
端子数量	48
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	LFBGA
封装等效代码	BGA48,6X8,30
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2.5/3.3 V
认证状态	Not Qualified
座面最大高度	1.35 mm
最大待机电流	0.000005 A
最小待机电流	2.5 V
最大压摆率	0.02 mA
最大供电电压 (Vsup)	3.45 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	6 mm
Base Number Matches	1

IS62LV12816ALL-10B相似产品对比

	IS62LV12816ALL-10B	IS62LV12816ALL-10BI	IS62LV12816ALL-10TI	IS62LV12816ALL-70T	IS62LV12816ALL-70TI	IS62LV12816ALL-10T	IS62LV12816ALL-55TI	IS62LV12816ALL-55T	IS62LV12816ALL-70B	IS62LV12816ALL-70BI
描述	Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48	Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 55ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 55ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48	Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	BGA	BGA	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	BGA	BGA
包装说明	6 X 8 MM, MINI, BGA-48	6 X 8 MM, MINI, BGA-48	TSOP2-44	TSOP2-44	TSOP2-44	TSOP2-44	TSOP2-44	TSOP2-44	6 X 8 MM, MINI, BGA-48	6 X 8 MM, MINI, BGA-48
针数	48	48	44	44	44	44	44	44	48	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli	compli	compli
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	100 ns	100 ns	100 ns	70 ns	70 ns	100 ns	55 ns	55 ns	70 ns	70 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B48	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PBGA-B48	R-PBGA-B48
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	8 mm	8 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	8 mm	8 mm
内存密度	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bi	2097152 bi	2097152 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	48	48	44	44	44	44	44	44	48	48
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C	85 °C
组织	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	LFBGA	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	LFBGA	LFBGA
封装等效代码	BGA48,6X8,30	BGA48,6X8,30	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	BGA48,6X8,30	BGA48,6X8,30
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.35 mm	1.35 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.35 mm	1.35 mm
最大待机电流	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
最小待机电流	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
最大压摆率	0.02 mA	0.04 mA	0.04 mA	0.03 mA	0.05 mA	0.02 mA	0.06 mA	0.04 mA	0.03 mA	0.05 mA
最大供电电压 (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
最小供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.75 mm	0.75 mm
端子位置	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	6 mm	6 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	6 mm	6 mm
厂商名称	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )

IS62LV12816ALL-10B

IS62LV12816ALL-10B概述

IS62LV12816ALL-10B规格参数

IS62LV12816ALL-10B相似产品对比

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