电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

320-AG19DC

产品描述IC Socket, DIP20, 20 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,
产品类别插座   
文件大小51KB,共2页
制造商ABB
官网地址http://www.abb.com/
下载文档 详细参数 全文预览

320-AG19DC概述

IC Socket, DIP20, 20 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,

320-AG19DC规格参数

参数名称属性值
厂商名称ABB
Reach Compliance Codeunknown
其他特性WITH STANDOFFS
主体宽度0.4 inch
主体深度0.21 inch
主体长度1 inch
联系完成配合NOT SPECIFIED
触点材料NOT SPECIFIED
触点样式SQ PIN-SKT
目前评级2 A
设备插槽类型IC SOCKET
使用的设备类型DIP20
介电耐压1000VAC V
外壳材料POLYESTER
绝缘电阻5000000000 Ω
制造商序列号300C
插接触点节距0.1 inch
安装方式STRAIGHT
触点数20
最高工作温度105 °C
最低工作温度-55 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.3 mm
端子节距2.54 mm
端接类型SOLDER
Base Number Matches1

文档预览

下载PDF文档
300C Series
A
Stamped Dual Wipe Contact DIP Sockets
328-AG19DC
FEATURES:
The Augat 300C Series dual wipe contact adds a new family of
product to Augat's low cost DIP socket line.
• Closed bottom prevents solder wicking
• Standoff's facilitate board cleaning
• Low profile design
Recognized under the Component Program of Underwriters
®
Laboratories, Inc. File No. E111362
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition III, 15 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition G, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 170 Grams (6.0 oz.) with .009" x .015"
(0,23 x 0,38) IC lead typ.
Contact Retention .......... 340 Grams (12.0 oz.) minimum
Solderability .................. Passed MIL-STD-202, Method 208
Insertion Force .............. 169 Grams (6.0 oz.) average with a .013"x .020"
(0,33 x 0,51) dia. polished steel pin
Withdrawal Force .......... 43 Grams (1.5 oz.) average with a .009" x .015"
(0,23 x 0,38) dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 2 Amps
Capacitance .................... .5 pF per MIL-STD-202, Method 305
(Adjacent contacts max.)
Insulation Resistance .... 5,000 Megohms @ 500 VDC per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1
Temperature Cycling .... Passed MIL-STD-1344, Method 1003.1
Operation Temperature .. Gold -55°C to +125°C
Tin -55°C to +105°C
Salt Spray ...................... Passed MIL-STD-1344, Method 1001.1
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34))
• PCB Hole Size Range: .035"
±
.003" (0,89
±
0,08) standard tail
• IC Pin Dimension Range: .008" x .015" ( 0,20 x 0,38) through
.013" x .020" (0,33 x 0,51), .100" (2,54) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Contacts .......................... Phosphor bronze
Plating ............................ Tin/lead
Quality & Innovation From The
Product Group
A8
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2174  1450  1170  685  2475  44  23  33  36  49 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved