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5962-88726113A

产品描述UV PLD, 15ns, 10-Cell, CMOS, CQCC28, CERAMIC, LCC-28
产品类别可编程逻辑    可编程逻辑器件   
文件大小541KB,共17页
制造商Atmel (Microchip)
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5962-88726113A概述

UV PLD, 15ns, 10-Cell, CMOS, CQCC28, CERAMIC, LCC-28

5962-88726113A规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Atmel (Microchip)
零件包装代码QLCC
包装说明QCCN, LCC28,.45SQ
针数28
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
其他特性NO
最大时钟频率41 MHz
系统内可编程NO
JESD-30 代码S-CQCC-N28
JESD-609代码e0
JTAG BSTNO
长度11.45 mm
专用输入次数11
I/O 线路数量10
宏单元数10
端子数量28
最高工作温度125 °C
最低工作温度-55 °C
组织11 DEDICATED INPUTS, 10 I/O
输出函数MACROCELL
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装等效代码LCC28,.45SQ
封装形状SQUARE
封装形式CHIP CARRIER
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
可编程逻辑类型UV PLD
传播延迟15 ns
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度2.79 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度11.45 mm
Base Number Matches1

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Features
Advanced, High-speed Programmable Logic Device – Superset of 22V10
– Improved Performance - 7.5 ns t
PD
, 95 MHz External Operation
– Enhanced Logic Flexibility
– Backward Compatible with ATV750(L) Software and Hardware
New Flip-flop Features
– D- or T-type
– Product Term or Direct Input Pin Clocking
High-speed Erasable Programmable Logic Devices
– 7.5 ns Maximum Pin-to-pin Delay
Device
ATV750B
ATV750BL
I
CC
, Standby
125 mA
15 mA
Highest Density Programmable Logic Available in a 24-pin Package
Increased Logic Flexibility
– 42 Array Inputs, 20 Sum Terms and 20 Flip-flops
High-speed UV
Erasable
Programmable
Logic Device
ATV750B
ATV750BL
Commercial and
industrial versions
are obsolete. Please
use ATF750C.
Military versions
continue to be available,
but please do not
use for new designs.
For new military
applications,
recommend multiple
ATF22V10s.
Enhanced Output Logic Flexibility
– All 20 Flip-flops Feed Back Internally
– 10 Flip-flops are Also Available as Outputs
Full Military, Commercial and Industrial Temperature Ranges
Logic Diagram
Description
The ATV750B(L) is twice as powerful as most other 24-pin programmable logic
devices. Increased product terms, sum terms, flip-flops and output logic configurations
translate into more usable gates. High-speed logic and uniform, predictable delays
guarantee fast in-system performance.
(continued)
Pin Name
CLK
IN
I/O
*
V
CC
Function
Clock
Logic Inputs
Bi-directional Buffers
No Internal Connection
+5V Supply
IN
IN
GND
*
IN
I/O
I/O
CLK/IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IN
4
3
2
1
28
27
26
IN
IN
CLK/IN
*
VCC
I/O
I/O
12
13
14
15
16
17
18
IN
IN
IN
*
IN
IN
IN
5
6
7
8
9
10
11
25
24
23
22
21
20
19
I/O
I/O
I/O
*
I/O
I/O
I/O
Pin Configurations
DIP/SOIC
PLCC/LCC
Rev. 0301H–03/00
1

5962-88726113A相似产品对比

5962-88726113A 5962-88726093A 5962-88726083A 5962-8872611LA
描述 UV PLD, 15ns, 10-Cell, CMOS, CQCC28, CERAMIC, LCC-28 UV PLD, 15ns, 10-Cell, CMOS, CQCC28, CERAMIC, LCC-28 UV PLD, 10ns, 10-Cell, CMOS, CQCC28, CERAMIC, LCC-28 UV PLD, 15ns, 10-Cell, CMOS, CDIP24, CERAMIC, DIP-24
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 QLCC QLCC QLCC DIP
包装说明 QCCN, LCC28,.45SQ CERAMIC, LCC-28 CERAMIC, LCC-28 DIP, DIP24,.3
针数 28 28 28 24
Reach Compliance Code unknown unknow unknown compliant
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
其他特性 NO 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS NO
最大时钟频率 41 MHz 50 MHz 71 MHz 41 MHz
系统内可编程 NO NO NO NO
JESD-30 代码 S-CQCC-N28 S-CQCC-N28 S-CQCC-N28 R-GDIP-T24
JESD-609代码 e0 e0 e0 e0
JTAG BST NO NO NO NO
长度 11.45 mm 11.45 mm 11.45 mm 32 mm
专用输入次数 11 11 11 11
I/O 线路数量 10 10 10 10
宏单元数 10 10 10 10
端子数量 28 28 28 24
最高工作温度 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C
组织 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
封装代码 QCCN QCCN QCCN DIP
封装等效代码 LCC28,.45SQ LCC28,.45SQ LCC28,.45SQ DIP24,.3
封装形状 SQUARE SQUARE SQUARE RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V 5 V
可编程逻辑类型 UV PLD UV PLD UV PLD UV PLD
传播延迟 15 ns 15 ns 10 ns 15 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
座面最大高度 2.79 mm 2.79 mm 2.79 mm 5.08 mm
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V
表面贴装 YES YES YES NO
技术 CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped
端子形式 NO LEAD NO LEAD NO LEAD THROUGH-HOLE
端子节距 1.27 mm 1.27 mm 1.27 mm 2.54 mm
端子位置 QUAD QUAD QUAD DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 11.45 mm 11.45 mm 11.45 mm 7.62 mm
Base Number Matches 1 1 1 1
厂商名称 Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip)

 
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