4096-word x 1-bit High Speed CMOS Static RAM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Hitachi （Renesas ） |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP18,.3 |
| 针数 | 18 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 35 ns |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e0 |
| 长度 | 22 mm |
| 内存密度 | 4096 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 18 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4KX1 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大待机电流 | 0.00005 A |
| 最小待机电流 | 2 V |
| 最大压摆率 | 0.08 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| HM6147HLP-35 | HM6147H | HM6147HLP-45 | HM6147HLP-55 | HM6147HP-35 | HM6147HP-45 | HM6147HP-55 | |
|---|---|---|---|---|---|---|---|
| 描述 | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Hitachi （Renesas ） | - | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| 零件包装代码 | DIP | - | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP18,.3 | - | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| 针数 | 18 | - | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | - | N | N | N | N | N |
| 最长访问时间 | 35 ns | - | 45 ns | 55 ns | 35 ns | 45 ns | 55 ns |
| I/O 类型 | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDIP-T18 | - | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| 长度 | 22 mm | - | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
| 内存密度 | 4096 bi | - | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi |
| 内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | - | 18 | 18 | 18 | 18 | 18 |
| 字数 | 4096 words | - | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | - | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4KX1 | - | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | - | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP18,.3 | - | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大待机电流 | 0.00005 A | - | 0.00005 A | 0.00005 A | 0.0008 A | 0.0008 A | 0.0008 A |
| 最大压摆率 | 0.08 mA | - | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | NO | NO | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |
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