8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, QCC20, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-1, LFCSP-20
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 20 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 2.9 V |
最小模拟输入电压 | 0.25 V |
最长转换时间 | 2.2 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-XQCC-N20 |
JESD-609代码 | e3 |
长度 | 4 mm |
最大线性误差 (EL) | 0.0023% |
湿度敏感等级 | 3 |
模拟输入通道数量 | 8 |
位数 | 16 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
采样速率 | 0.25 MHz |
采样并保持/跟踪并保持 | TRACK |
座面最大高度 | 1 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 4 mm |
Base Number Matches | 1 |
AD7689BCPZ | AD7689ACPZ | AD7682BCPZ | AD7682BCPZRL7 | |
---|---|---|---|---|
描述 | 8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, QCC20, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-1, LFCSP-20 | 8-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, QCC20, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-1, LFCSP-20 | 4-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, QCC20, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-1, LFCSP-20 | 4-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, QCC20, 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-1, LFCSP-20 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
针数 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
最大模拟输入电压 | 2.9 V | 2.9 V | 2.9 V | 2.9 V |
最小模拟输入电压 | 0.25 V | 0.25 V | 0.25 V | 0.25 V |
最长转换时间 | 2.2 µs | 2.2 µs | 2.2 µs | 2.2 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 |
JESD-609代码 | e3 | e3 | e3 | e3 |
长度 | 4 mm | 4 mm | 4 mm | 4 mm |
最大线性误差 (EL) | 0.0023% | 0.0061% | 0.0023% | 0.0023% |
湿度敏感等级 | 3 | 3 | 3 | 3 |
模拟输入通道数量 | 8 | 8 | 4 | 4 |
位数 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
采样速率 | 0.25 MHz | 0.25 MHz | 0.25 MHz | 0.25 MHz |
采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | 40 |
宽度 | 4 mm | 4 mm | 4 mm | 4 mm |
Base Number Matches | 1 | 1 | 1 | - |
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