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74LCX38MTCX_NL

产品描述NAND Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, 4.40 MM, LEAD FREE, MO-153AB, TSSOP-14
产品类别逻辑   
文件大小120KB,共7页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
标准
下载文档 详细参数 选型对比 全文预览

74LCX38MTCX_NL概述

NAND Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, 4.40 MM, LEAD FREE, MO-153AB, TSSOP-14

74LCX38MTCX_NL规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Fairchild
零件包装代码TSSOP
包装说明4.40 MM, LEAD FREE, MO-153AB, TSSOP-14
针数14
Reach Compliance Codenot_compliant
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G14
JESD-609代码e3
长度5 mm
逻辑集成电路类型NAND GATE
最大I(ol)0.024 A
湿度敏感等级1
功能数量4
输入次数2
端子数量14
最高工作温度85 °C
最低工作温度-40 °C
输出特性OPEN-DRAIN
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP14,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源3.3 V
传播延迟(tpd)6.5 ns
认证状态Not Qualified
施密特触发器NO
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度4.4 mm
Base Number Matches1

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74LCX38 Low Voltage Quad 2-Input NAND Gate (Open Drain) with 5V Tolerant Inputs
October 1995
Revised February 2005
74LCX38
Low Voltage Quad 2-Input NAND Gate (Open Drain)
with 5V Tolerant Inputs
General Description
The LCX38 contains four 2-input open drain NAND gates.
The inputs tolerate voltages up to 7V allowing the interface
of 5V systems to 3V systems.
The 74LCX38 is fabricated with advanced CMOS technol-
ogy to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s
5V tolerant inputs
s
2.3V to 3.6V V
CC
specifications provided
s
5.0 ns t
PD
max (V
CC
3.3V), 10
P
A I
CC
max
3.0V)
s
Power down high impedance inputs and outputs
s
24 mA output drive (V
CC
s
Implements patented noise/EMI reduction circuitry
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human body model
!
2000V
Machine model
!
150V
Ordering Code:
Order Number
74LCX38M
74LCX38MX_NL
(Note 1)
74LCX38SJ
74LCX38MTC
74LCX38MTCX_NL
(Note 1)
Package
Number
M14A
M14A
M14D
MTC14
MTC14
Package Description
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1:
“_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Logic Symbol
IEEE/IEC
Connection Diagram
Pin Descriptions
Pin Names
A
n
, B
n
O
n
© 2005 Fairchild Semiconductor Corporation
DS012574
Description
Inputs
Outputs
www.fairchildsemi.com

74LCX38MTCX_NL相似产品对比

74LCX38MTCX_NL 74LCX38SJX_NL 74LCX38MX_NL 74LCX38MTC_NL
描述 NAND Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, 4.40 MM, LEAD FREE, MO-153AB, TSSOP-14 NAND Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 NAND Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, 0.150 INCH, LEAD FREE, MS-012, SOIC-14 NAND Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, 4.40 MM, LEAD FREE, MO-153AB, TSSOP-14
厂商名称 Fairchild Fairchild Fairchild Fairchild
零件包装代码 TSSOP SOIC SOIC TSSOP
包装说明 4.40 MM, LEAD FREE, MO-153AB, TSSOP-14 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 0.150 INCH, LEAD FREE, MS-012, SOIC-14 TSSOP,
针数 14 14 14 14
Reach Compliance Code not_compliant compliant compliant unknown
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609代码 e3 e3 e3 e3/e4
长度 5 mm 10.2 mm 8.6235 mm 5 mm
逻辑集成电路类型 NAND GATE NAND GATE NAND GATE NAND GATE
功能数量 4 4 4 4
输入次数 2 2 2 2
端子数量 14 14 14 14
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
输出特性 OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SOP SOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd) 6.5 ns 6.5 ns 6.5 ns 6.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 2.1 mm 1.753 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) MATTE TIN/NICKEL PALLADIUM GOLD
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 1.27 mm 1.27 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL
宽度 4.4 mm 5.3 mm 3.9 mm 4.4 mm
Base Number Matches 1 1 1 1
是否Rohs认证 符合 符合 符合 -
最大I(ol) 0.024 A 0.024 A 0.024 A -
湿度敏感等级 1 1 1 -
封装等效代码 TSSOP14,.25 SOP14,.3 SOP14,.25 -
峰值回流温度(摄氏度) 260 260 260 -
电源 3.3 V 3.3 V 3.3 V -
施密特触发器 NO NO NO -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -

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