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74VHC126BQ

产品描述AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
产品类别逻辑   
文件大小82KB,共15页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准  
下载文档 详细参数 选型对比 全文预览

74VHC126BQ概述

AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

74VHC126BQ规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码QFN
包装说明2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
针数14
Reach Compliance Codeunknown
系列AHC/VHC/H/U/V
JESD-30 代码R-PQCC-N14
JESD-609代码e4
长度3 mm
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数1
功能数量4
端口数量2
端子数量14
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码HVQCCN
封装形状RECTANGULAR
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)260
传播延迟(tpd)14.5 ns
认证状态Not Qualified
座面最大高度1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层NICKEL PALLADIUM GOLD
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度2.5 mm
Base Number Matches1

文档预览

下载PDF文档
74VHC126; 74VHCT126
Quad buffer/line driver; 3-state
Rev. 01 — 13 August 2009
Product data sheet
1. General description
The 74VHC126; 74VHCT126 are high-speed Si-gate CMOS devices and are pin
compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance with
JEDEC standard No. 7-A.
The 74VHC126; 74VHCT126 provide four non-inverting buffer/line drivers with 3-state
outputs. The 3-state outputs (nY) are controlled by the output enable input (nOE).
A LOW-level at pin nOE causes the outputs to assume a high-impedance OFF-state.
The 74VHC126; 74VHCT126 are identical to the 74VHC125; 74VHCT125 but have active
HIGH output enable inputs.
2. Features
I
I
I
I
Balanced propagation delays
All inputs have Schmitt-trigger action
Inputs accept voltages higher than V
CC
Input levels:
N
The 74VHC126 operates with CMOS input level
N
The 74VHCT126 operates with TTL input level
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
N
CDM JESD22-C101C exceeds 1000 V
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C

74VHC126BQ相似产品对比

74VHC126BQ 74VHCT126BQ 74VHCT126PW 74VHC126D 74VHC126PW 74VHCT126D
描述 AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 IC AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14, Bus Driver/Transceiver IC AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14, Bus Driver/Transceiver AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 IC AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14, Bus Driver/Transceiver
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 QFN QFN TSSOP SOIC TSSOP SOIC
包装说明 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 TSSOP, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 TSSOP, SOP,
针数 14 14 14 14 14 14
Reach Compliance Code unknown unknown unknown unknown compliant unknown
系列 AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHC/VHC/H/U/V AHC/VHC/H/U/V AHCT/VHCT/VT
JESD-30 代码 R-PQCC-N14 R-PQCC-N14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609代码 e4 e4 e4 e4 e4 e4
长度 3 mm 3 mm 5 mm 8.65 mm 5 mm 8.65 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
湿度敏感等级 1 1 1 1 1 1
位数 1 1 1 1 1 1
功能数量 4 4 4 4 4 4
端口数量 2 2 2 2 2 2
端子数量 14 14 14 14 14 14
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVQCCN HVQCCN TSSOP SOP TSSOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
峰值回流温度(摄氏度) 260 260 260 260 260 260
传播延迟(tpd) 14.5 ns 9.5 ns 9.5 ns 14.5 ns 14.5 ns 9.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 1 mm 1.1 mm 1.75 mm 1.1 mm 1.75 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 4.5 V 4.5 V 2 V 2 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 NO LEAD NO LEAD GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm
端子位置 QUAD QUAD DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 2.5 mm 2.5 mm 4.4 mm 3.9 mm 4.4 mm 3.9 mm
Base Number Matches 1 1 1 1 1 1

 
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