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74LCX162244MEAX_NL

产品描述Bus Driver, LVC/LCX/Z Series, 4-Func, 4-Bit, True Output, CMOS, PDSO48, 0.300 INCH, MO-118, SSOP-48
产品类别逻辑   
文件大小213KB,共10页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
标准
下载文档 详细参数 选型对比 全文预览

74LCX162244MEAX_NL概述

Bus Driver, LVC/LCX/Z Series, 4-Func, 4-Bit, True Output, CMOS, PDSO48, 0.300 INCH, MO-118, SSOP-48

74LCX162244MEAX_NL规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Fairchild
零件包装代码SSOP
包装说明SSOP, SSOP48,.4
针数48
Reach Compliance Codecompliant
控制类型ENABLE LOW
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G48
JESD-609代码e3
长度15.875 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.012 A
湿度敏感等级1
位数4
功能数量4
端口数量2
端子数量48
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE WITH SERIES RESISTOR
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SSOP
封装等效代码SSOP48,.4
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源3.3 V
Prop。Delay @ Nom-Sup5.3 ns
传播延迟(tpd)6.4 ns
认证状态Not Qualified
座面最大高度2.74 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.635 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.495 mm
Base Number Matches1

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74LCX162244 Low Voltage 16-Bit Buffer/Line Driver with 26: Series Resistors in Outputs
September 2000
Revised May 2005
74LCX162244
Low Voltage 16-Bit Buffer/Line Driver
with 26: Series Resistors in Outputs
General Description
The LCX162244 contains sixteen non-inverting buffers with
3-STATE outputs designed to be employed as a memory
and address driver, clock driver, or bus oriented transmit-
ter/receiver. The device is nibble controlled. Each nibble
has separate 3-STATE control inputs which can be shorted
together for full 16-bit operation.
The LCX162244 is designed for low voltage (2.5V or 3.3V)
V
CC
applications with capability of interfacing to a 5V signal
environment.
In addition, the outputs include equivalent 26
:
(nominal)
series resistors to reduce overshoot and undershoot and
are designed to sink/source up to 12 mA at V
CC
3.0V.
The LCX162244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
s
5V tolerant inputs and outputs
s
2.3V–3.6V V
CC
specifications provided
s
Outputs include equivalent series resistance of 26
:
to
make external termination resistors unnecessary and
reduce overshoot and undershoot
s
5.3 ns t
PD
max (V
CC
3.0V), 20
P
A I
CC
max
3.0V)
s
Power down high impedance inputs and outputs
s
r
12 mA output drive (V
CC
s
Implements patented noise/EMI reduction circuitry
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human body model
!
2000V
Machine model
!
200V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74LCX162244GX
(Note 1)
74LCX162244MEA
(Note 2)
74LCX162244MTD
(Note 2)
Package Number
BGA54A
(Preliminary)
MS48A
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1:
BGA package available in Tape and Reel only.
Note 2:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
© 2005 Fairchild Semiconductor Corporation
DS500471
www.fairchildsemi.com

74LCX162244MEAX_NL相似产品对比

74LCX162244MEAX_NL 74LCX162244MTDX_NL
描述 Bus Driver, LVC/LCX/Z Series, 4-Func, 4-Bit, True Output, CMOS, PDSO48, 0.300 INCH, MO-118, SSOP-48 Bus Driver, LVC/LCX/Z Series, 4-Func, 4-Bit, True Output, CMOS, PDSO48, 6.10 MM, MO-153ED, TSSOP-48
是否Rohs认证 符合 符合
厂商名称 Fairchild Fairchild
零件包装代码 SSOP TSSOP
包装说明 SSOP, SSOP48,.4 TSSOP, TSSOP48,.3,20
针数 48 48
Reach Compliance Code compliant compliant
控制类型 ENABLE LOW ENABLE LOW
系列 LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G48 R-PDSO-G48
JESD-609代码 e3 e3
长度 15.875 mm 12.5 mm
负载电容(CL) 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER
最大I(ol) 0.012 A 0.012 A
湿度敏感等级 1 2
位数 4 4
功能数量 4 4
端口数量 2 2
端子数量 48 48
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
输出特性 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
输出极性 TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP TSSOP
封装等效代码 SSOP48,.4 TSSOP48,.3,20
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 260
电源 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 5.3 ns 5.3 ns
传播延迟(tpd) 6.4 ns 6.4 ns
认证状态 Not Qualified Not Qualified
座面最大高度 2.74 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2 V 2 V
标称供电电压 (Vsup) 2.5 V 2.5 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING GULL WING
端子节距 0.635 mm 0.5 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 7.495 mm 6.1 mm
Base Number Matches 1 1

 
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