32-BIT, 100 MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | BGA |
| 包装说明 | 27 X 27 MM, PLASTIC, BGA-256 |
| 针数 | 256 |
| Reach Compliance Code | not_compliant |
| 地址总线宽度 | 32 |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 50 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 集成缓存 | YES |
| JESD-30 代码 | S-PBGA-B256 |
| JESD-609代码 | e0 |
| 长度 | 17 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 256 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA256,16X16,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.5 mm |
| 速度 | 100 MHz |
| 最大压摆率 | 480 mA |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 3.135 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 17 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
| 79RC32V334-100BBI | 79RC32V334-133BB | 79RC32V334-133BBI | IDT79RC32V332-133DPI | IDT79RC32V332-100DPI | |
|---|---|---|---|---|---|
| 描述 | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | RISC Microcontroller, 32-Bit, 133MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | RISC Microcontroller, 32-Bit, 100MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | QFP | QFP |
| 包装说明 | 27 X 27 MM, PLASTIC, BGA-256 | 27 X 27 MM, PLASTIC, BGA-256 | 27 X 27 MM, PLASTIC, BGA-256 | FQFP, QFP208,1.2SQ,20 | FQFP, QFP208,1.2SQ,20 |
| 针数 | 256 | 256 | 256 | 208 | 208 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 地址总线宽度 | 32 | 32 | 32 | 32 | 32 |
| 位大小 | 32 | 32 | 32 | 32 | 32 |
| 最大时钟频率 | 50 MHz | 66.67 MHz | 66.67 MHz | 66.66 MHz | 50 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 |
| JESD-30 代码 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 17 mm | 17 mm | 17 mm | 28 mm | 28 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 256 | 256 | 256 | 208 | 208 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | FQFP | FQFP |
| 封装等效代码 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.5 mm | 3.5 mm | 3.5 mm | 4.1 mm | 4.1 mm |
| 速度 | 100 MHz | 133 MHz | 133 MHz | 133 MHz | 100 MHz |
| 最大压摆率 | 480 mA | 630 mA | 630 mA | 630 mA | 480 mA |
| 最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | BALL | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 1 mm | 1 mm | 1 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 17 mm | 17 mm | 17 mm | 28 mm | 28 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - |
| 边界扫描 | YES | YES | YES | - | - |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | - | - |
| 集成缓存 | YES | YES | YES | - | - |
| 低功率模式 | YES | YES | YES | - | - |
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