2SK3772-01
N-CHANNEL SILICON POWER MOSFET
Outline Drawings
(mm)
TO-220AB
200406
FUJI POWER MOSFET
Super FAP-G Series
Features
High speed switching
No secondary breakdown
Avalanche-proof
Low on-resistance
Low driving power
Applications
Switching regulators
DC-DC converters
UPS (Uninterruptible Power Supply)
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Drain-source voltage
Continuous Drain Current
Pulsed Drain Current
Gate-Source Voltage
Maximum Avalanche current
Non-Repetitive
Maximum Avalanche Energy
Repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. Power Dissipation
Operating and Storage
Temperature range
Symbol
V
DS
V
DSX
I
D
I
D(puls]
V
GS
I
AR
E
AS
E
AR
dV
DS
/dt
dV/dt
P
D
T
ch
T
stg
Ratings
300
300
32
±128
±30
32
597.4
27
20
5
270
2.02
+150
-55 to +150
Unit
V
V
A
A
V
A
mJ
mJ
Remarks
V
GS
=-30V
Equivalent circuit schematic
Drain(D)
Gate(G)
Note *1
Note *2
Note *3
Source(S)
Note *1:Tch < 150°C,Repetitive and Non-repetitive
=
Note *2:StartingTch=25°C,I
AS
=13A,L= 6.13mH,
V
CC
=48V,R
G
=50Ω
E
AS
limited by maximum channel temperature
and Avalanche current.
See to the ‘Avalanche Energy’ graph
Note *3:Repetitive rating:Pulse width limited by
maximum channel temperature.
See to the ‘Transient Thermal impedance’
graph.
Note *4:I
F
< -I
D
, -di/dt = 50A/
µ
s,V
CC
< BV
DSS
,Tch<150°C
=
=
=
kV/µs V
DS
<300V
=
kV/µs Note *4
Tc=25°C
W
Ta=25°C
°C
°C
Electrical characteristics (T
c
=25°C unless otherwise specified)
Item
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Drain-Source On-State Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Time t
on
Turn-Off Time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
Symbol
BV
DSS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
V
SD
t
rr
Q
rr
Symbol
R
th(ch-c)
R
th(ch-a)
Test Conditions
I
D
= 250µA
V
GS
=0V
I
D
= 250µA
V
DS
=V
GS
V
DS
=600V V
GS
=0V
V
DS
=480V V
GS
=0V
V
GS
=±30V V
DS
=0V
I
D
=16A V
GS
=10V
I
D
=16A V
DS
=25V
V
DS
=25V
V
GS
=0V
f=1MH
V
CC
=180V
I
D
=16A
V
GS
=10V
R
GS
=10
Ω
V
CC
=150V
I
D
=32A
V
GS
=10V
I
F
=32A V
GS
=0V T
ch
=25°C
I
F
=32A V
GS
=0V
-di/dt=100A/µs T
ch
=25°C
Test Conditions
channel to case
channel to ambient
T
ch
=25°C
T
ch
=125°C
Min.
300
3.0
Typ.
Max.
5.0
25
250
100
0.13
Units
V
V
µA
µA
nA
Ω
S
pF
12
0.10
24
1970
2955
335
502
20
30
29
44
7.5
11
57
86
7
10.5
44.5
67
18
27
13.5
20.5
0.90
1.50
270
3.0
ns
nC
V
ns
µC
Thermal characteristics
Item
Thermal resistance
www.fujielectric.co.jp/fdt/scd
Min.
Typ.
Max.
0.463
62
Units
°C/W
°C/W
1
2SK3772-01
Characteristics
Allowable Power Dissipation
PD=f(Tc)
FUJI POWER MOSFET
400
80
Typical Output Characteristics
ID=f(VDS):80
µ
s pulse test,Tch=25
°
C
70
20V
10V
300
60
8V
50
PD [W]
ID [A]
200
40
30
7V
100
20
6.5V
10
VGS=6.0V
0
0
25
50
75
100
125
150
0
0
4
8
12
16
20
24
Tc [
°
C]
VDS [V]
100
Typical Transfer Characteristic
ID=f(VGS):80
µ
s pulse test,VDS=25V,Tch=25
°
C
100
Typical Transconductance
gfs=f(ID):80
µ
s pulse test,VDS=25V,Tch=25
°
C
10
10
ID[A]
1
1
0.1
0.1
0.1
0
1
2
3
4
5
6
7
8
9
10
gfs [S]
1
10
100
VGS[V]
ID [A]
0.30
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80
µ
s pulse test,Tch=25
°
C
VGS=6V
6.5V
7V
0.5
Drain-Source On-state Resistance
RDS(on)=f(Tch):ID=16A,VGS=10V
0.25
0.4
RDS(on) [
Ω
]
0.20
RDS(on) [
Ω
]
0.3
8V
0.15
10V
20V
0.10
0.2
max.
typ.
0.1
0.05
0.00
0
10
20
30
40
50
60
0.0
-50
-25
0
25
50
75
100
125
150
ID [A]
Tch [
°
C]
2
2SK3772-01
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch):VDS=VGS,ID=250
µ
A
FUJI POWER MOSFET
7.0
6.5
6.0
5.5
5.0
14
Typical Gate Charge Characteristics
VGS=f(Qg):ID=32A,Tch=25
°
C
12
Vcc= 60V
max.
10
150V
240V
VGS(th) [V]
4.5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
100
125
150
min.
VGS [V]
4.0
8
6
4
2
0
0
10
20
30
40
50
60
70
80
Tch [
°
C]
Qg [nC]
10
4
Typical Capacitance
C=f(VDS):VGS=0V,f=1MHz
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80
µ
s pulse test,Tch=25
°
C
100
Ciss
10
3
10
C [pF]
10
2
Coss
IF [A]
1
3
10
1
Crss
10
0
10
0
10
1
10
2
10
0.1
0.00
0.25
0.50
0.75
1.00
1.25
1.50
VDS [V]
VSD [V]
10
3
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=180V,VGS=10V,RG=10
Ω
700
Maximum Avalanche Energy vs. starting Tch
E(AV)=f(starting Tch):Vcc=48V,I(AV)<=32A
I
AS
=13A
600
500
10
2
td(off)
t [ns]
td(on)
EAV [mJ]
400
I
AS
=20A
300
I
AS
=32A
200
tf
10
1
tr
100
10
0
0
-1
10
10
0
10
1
10
2
0
25
50
75
100
125
150
ID [A]
starting Tch [
°
C]
3
2SK3772-01
FUJI POWER MOSFET
10
2
Maximum Avalanche Current Pulsewidth
I
AV
=f(t
AV
):starting Tch=25
°
C,Vcc=48V
Single Pulse
Avalanche Current I
AV
[A]
10
1
10
0
10
-1
10
-8
10
-2
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
t
AV
[sec]
10
1
Maximum Transient Thermal Impedance
Zth(ch-c)=f(t):D=0
10
0
Zth(ch-c) [°C/W]
10
-1
10
-2
10
-3
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
t [sec]
http://www.fujielectric.co.jp/fdt/scd/
4
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
