Ultrahigh Speed Operational Amplifier
| LT1191 | LT1191CS8 | LT1191CN8 | LT1191_01 | LT1191MJ8 | LT1191CJ8 | |
|---|---|---|---|---|---|---|
| 描述 | Ultrahigh Speed Operational Amplifier | Ultrahigh Speed Operational Amplifier | Ultrahigh Speed Operational Amplifier | Ultrahigh Speed Operational Amplifier | Ultrahigh Speed Operational Amplifier | Ultrahigh Speed Operational Amplifier |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | - | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | - | SOIC | DIP | - | DIP | DIP |
| 包装说明 | - | SOP, SOP8,.25 | DIP, DIP8,.3 | - | DIP, DIP8,.3 | DIP, DIP8,.3 |
| 针数 | - | 8 | 8 | - | 8 | 8 |
| Reach Compliance Code | - | _compli | _compli | - | unknow | unknow |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 放大器类型 | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | - | 2.5 µA | 2.5 µA | - | 2.5 µA | 2.5 µA |
| 25C 时的最大偏置电流 (IIB) | - | 2.5 µA | 2.5 µA | - | 2.5 µA | 2.5 µA |
| 最小共模抑制比 | - | 60 dB | 60 dB | - | 60 dB | 60 dB |
| 标称共模抑制比 | - | 70 dB | 70 dB | - | 70 dB | 70 dB |
| 频率补偿 | - | YES | YES | - | YES | YES |
| 最大输入失调电压 | - | 10000 µV | 6000 µV | - | 8000 µV | 6000 µV |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDIP-T8 | - | R-GDIP-T8 | R-GDIP-T8 |
| JESD-609代码 | - | e0 | e0 | - | e0 | e0 |
| 低-失调 | - | NO | NO | - | NO | NO |
| 负供电电压上限 | - | -9 V | -9 V | - | -9 V | -9 V |
| 标称负供电电压 (Vsup) | - | -5 V | -5 V | - | -5 V | -5 V |
| 功能数量 | - | 1 | 1 | - | 1 | 1 |
| 端子数量 | - | 8 | 8 | - | 8 | 8 |
| 最高工作温度 | - | 70 °C | 70 °C | - | 125 °C | 70 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | - | SOP | DIP | - | DIP | DIP |
| 封装等效代码 | - | SOP8,.25 | DIP8,.3 | - | DIP8,.3 | DIP8,.3 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | IN-LINE | - | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | - | 235 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 5/+-5 V | 5/+-5 V | - | 5/+-5 V | 5/+-5 V |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.75 mm | 3.937 mm | - | 5.08 mm | 5.08 mm |
| 最小摆率 | - | 325 V/us | 325 V/us | - | 325 V/us | 325 V/us |
| 标称压摆率 | - | 450 V/us | 450 V/us | - | 450 V/us | 450 V/us |
| 最大压摆率 | - | 38 mA | 38 mA | - | 38 mA | 38 mA |
| 供电电压上限 | - | 9 V | 9 V | - | 9 V | 9 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | - | YES | NO | - | NO | NO |
| 技术 | - | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | - | MILITARY | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 20 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 标称均一增益带宽 | - | 90000 kHz | 90000 kHz | - | 90000 kHz | 90000 kHz |
| 最小电压增益 | - | 20000 | 20000 | - | 20000 | 20000 |
| 宽带 | - | YES | YES | - | YES | YES |
| 宽度 | - | 3.9 mm | 7.62 mm | - | 7.62 mm | 7.62 mm |
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