Micropower Thermocouple Cold Junction Compensator
| LT1025_03 | LT1025ACN8 | LT1025MJ8 | LT1025AMJ8 | |
|---|---|---|---|---|
| 描述 | Micropower Thermocouple Cold Junction Compensator | Micropower Thermocouple Cold Junction Compensator | Micropower Thermocouple Cold Junction Compensator | Micropower Thermocouple Cold Junction Compensator |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | - | DIP | DIP | DIP |
| 包装说明 | - | DIP, | 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8 | 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8 |
| 针数 | - | 8 | 8 | 8 |
| Reach Compliance Code | - | _compli | unknow | unknow |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | - | R-PDIP-T8 | R-GDIP-T8 | R-GDIP-T8 |
| JESD-609代码 | - | e0 | e0 | e0 |
| 功能数量 | - | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 |
| 最高工作温度 | - | 70 °C | 125 °C | 125 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | - | DIP | DIP | DIP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 3.937 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | - | 36 V | 36 V | 36 V |
| 最小供电电压 (Vsup) | - | 4 V | 4 V | 4 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | NO | NO |
| 温度等级 | - | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 7.62 mm | 7.62 mm | 7.62 mm |
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