SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T24 |
| 长度 | 31.915 mm |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.334 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| 74F407PCQR | 74F407SJ | 74F407SJQR | 74F407LC | 74F407LCQR | 74F407FCQR | 74F407FC | 74F407PC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24, PLASTIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, EIAJ, SOIC-24 | SPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, EIAJ, SOIC-24 | SPECIALTY MICROPROCESSOR CIRCUIT, CQCC28, CERAMIC, LCC-28 | SPECIALTY MICROPROCESSOR CIRCUIT, CQCC28, CERAMIC, LCC-28 | SPECIALTY MICROPROCESSOR CIRCUIT, CDFP24, CERAMIC, FP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, CDFP24, CERAMIC, FP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24, PLASTIC, DIP-24 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, | SOP, | SOP, | QCCN, | QCCN, | DFP, | DFP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | S-CQCC-N28 | S-CQCC-N28 | R-GDFP-F24 | R-GDFP-F24 | R-PDIP-T24 |
| 长度 | 31.915 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm | 15.435 mm | 15.435 mm | 31.915 mm |
| 端子数量 | 24 | 24 | 24 | 28 | 28 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | QCCN | QCCN | DFP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.334 mm | 2.25 mm | 2.25 mm | 1.93 mm | 1.93 mm | 2.286 mm | 2.286 mm | 5.334 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | NO LEAD | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 5.3 mm | 5.3 mm | 11.43 mm | 11.43 mm | 9.4615 mm | 9.4615 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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