FIFO, 2KX9, 12ns, Asynchronous, CMOS, PDSO56, TSSOP-56
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | TSSOP |
包装说明 | TSSOP, |
针数 | 56 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 12 ns |
其他特性 | RETRANSMIT |
周期时间 | 20 ns |
JESD-30 代码 | R-PDSO-G56 |
JESD-609代码 | e3 |
长度 | 14 mm |
内存密度 | 18432 bit |
内存宽度 | 9 |
湿度敏感等级 | 1 |
功能数量 | 2 |
端子数量 | 56 |
字数 | 2048 words |
字数代码 | 2000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2KX9 |
可输出 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 6.1 mm |
Base Number Matches | 1 |
IDT7283L12PAG8 | IDT7285L12PAG8 | IDT7285L12PAG | IDT7281L12PAG | IDT7285L15PAGI | IDT7285L15PAGI8 | IDT7281L12PAG8 | IDT7281L15PAGI | IDT7281L15PAGI8 | |
---|---|---|---|---|---|---|---|---|---|
描述 | FIFO, 2KX9, 12ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 8KX9, 12ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 8KX9, 12ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56 | FIFO, 512X9, 12ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56 | FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56 | FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 512X9, 12ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56 | FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO56, TSSOP-56 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
包装说明 | TSSOP, | TSSOP, | TSSOP, TSSOP56,.3,20 | TSSOP, TSSOP56,.3,20 | TSSOP, TSSOP56,.3,20 | TSSOP, | TSSOP, | TSSOP, TSSOP56,.3,20 | TSSOP, |
针数 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 12 ns | 12 ns | 12 ns | 12 ns | 15 ns | 15 ns | 12 ns | 15 ns | 15 ns |
其他特性 | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
周期时间 | 20 ns | 20 ns | 20 ns | 20 ns | 25 ns | 25 ns | 20 ns | 25 ns | 25 ns |
JESD-30 代码 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
内存密度 | 18432 bit | 73728 bit | 73728 bit | 4608 bit | 73728 bit | 73728 bit | 4608 bit | 4608 bit | 4608 bit |
内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 1 | 1 | 1 | 2 | 2 | 1 | 2 |
端子数量 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
字数 | 2048 words | 8192 words | 8192 words | 512 words | 8192 words | 8192 words | 512 words | 512 words | 512 words |
字数代码 | 2000 | 8000 | 8000 | 512 | 8000 | 8000 | 512 | 512 | 512 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C |
组织 | 2KX9 | 8KX9 | 8KX9 | 512X9 | 8KX9 | 8KX9 | 512X9 | 512X9 | 512X9 |
可输出 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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