Product
Specification
108-1092
11Mar11 Rev F
AMPLIMITE* HD-22 Front Metal Shell, PCB Mounted Connector
1.
1.1.
SCOPE
Content
This specification covers performance, tests and quality requirements for AMPLIMITE* HD-22 right
angle and vertical printed circuit board mounted connectors.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using applicable inspection plan and product drawing.
1.3.
Qualification Test Results
Successful qualification testing on the subject product line was completed on 14Dec89. The
Qualification Test Report number for this testing is 501-104. Additional testing was completed on
09Jan02, the Engineering Report number for this testing 502-1125. This documentation is on file at and
available from Engineering Practices and Standards (EPS).
2.
APPLICABLE DOCUMENTS
The following TE Connectivity (TE) documents form a part of this specification to the extent specified
herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict
between the requirements of this specification and the product drawing, the product drawing shall take
precedence. In the event of conflict between the requirements of this specification and the referenced
documents, this specification shall take precedence.
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3.
3.1.
109-1: Test Specification (General Requirements for Test Specifications)
109 Series: Test Specifications as indicated in Figure 1
114-40021: Application Specification (AMPLIMITE* HD-22 Right Angle Front Metal Shell
Connectors)
114-40022: Application Specification (AMPLIMITE* HD-22 Straight Front Metal Shell PC Board
Connector)
501-104: Qualification Test Report (AMPLIMITE* HD-22 Front Metal Shell, PCB Mounted
Connector)
502-1125: Engineering Report (AMPLIMITE* HD-22 Front Metal Shell, PCB Mounted Connector)
REQUIREMENTS
Design and Construction
Product shall be of design, construction and physical dimensions specified on applicable product
drawing.
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
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All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at www.te.com/documents.
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Other products, logos, and company names might be trademarks of their respective owners.
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LOC B
108-1092
3.3.
Ratings
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Voltage:
•
UL: 250 volts Ac
•
CSA: 125 volts AC
Current:
•
Right angle: 2 amperes maximum per contact
•
Straight posted: 1.5 amperes maximum per contact
Temperature:
•
Regular housing: -55 to 105°
C
•
High temperature housing: -55 to 130°
C
3.4.
Performance and Test Description
Product is designed to meet electrical, mechanical and environmental performance requirements
specified in Figure 1. All tests are performed at ambient environmental conditions per AMP Specification
109-1 unless otherwise specified.
3.5.
Test Requirements and Procedures Summary
Test Description
Requirement
Meets requirements of product
drawing and Application
Specifications 114-40021 and 114-
40022.
ELECTRICAL
Procedure
Visual, dimensional and functional
per applicable quality inspection
plan.
Examination of product.
Termination resistance, dry circuit.
25 milliohms maximum final for 30
µin
gold.
30 milliohms maximum final for 15
µin
and gold flash.
∆R
10 milliohms.
1000 volts AC at sea level.
TE Spec 109-6-1.
Subject mated contacts assembled
in housing to 50 mv open circuit at
100 ma maximum.
See Figure 3.
TE Spec 109-29-1.
Test between adjacent contacts
and between contacts and metal
shell of unmated connector
assemblies.
TE Spec 109-28-4.
Test between adjacent contacts of
unmated connector assemblies.
Dielectric withstanding voltage.
Insulation resistance.
5000 megohms minimum initial.
1000 megohms minimum final.
Temperature rise vs current.
30° maximum temperatur e rise at TE Spec 109-45-1.
C
specified current.
Measure temperature rise vs
current.
MECHANICAL
Vibration, random.
No discontinuities greater than 1
microsecond.
See Note.
TE Spec 109-21-5, Test level G,
Duration 20 minutes.
Subject mated connectors to 23 G's
rms with 100 ma current applied.
See Figure 4.
Figure 1 (continued)
Rev F
2 of 8
108-1092
Test Description
Physical shock.
Requirement
No discontinuities greater than 1
microsecond.
See Note.
Procedure
TE Spec 109-26-1.
Subject mated connectors to 50 G's
half-sine shock pulses of 11
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
TE Spec 109-42, Condition A.
Measure force necessary to mate
connector assemblies at rate of 1
inch per minute.
Mating force.
Force in pounds maximum.
Grounding
Indents
Size Positions W/O With
1
15
5.6
33
2
26
9.8
38
3
44
16.5
46
4
62
23.3
52
5
78
29.3
58
Force in pounds maximum.
Grounding
Indents
Size Positions W/O With
1
15
5.6
33
2
26
9.8
38
3
44
16.5
46
4
62
23.3
52
5
78
29.3
58
See Note.
Unmating force.
TE Spec 109-42, Condition A.
Measure force necessary to
unmate connector assemblies at
rate of 1 inch per minute.
Durability.
TE Spec 109-27.
Mate and unmate connector
assemblies for 100 cycles for gold
flash and 500 cycles for 30
µin
gold
plating at maximum rate of 200
cycles per hour.
TE Spec 109-11-1.
Subject contacts to solderability for
connectors with tin-lead plated
solder tails.
TE Spec 109-11-11.
Subject contacts to solderability for
connectors with lead-free tin plated
soldertails.
Solderability.
Solderable area shall have
minimum of 95% solder coverage.
ENVIRONMENTAL
Thermal shock.
See Note.
TE Spec 109-22.
Subject mated connectors to 100
cycles between -55 and 105° for
C
regular housings and -55 and
130° for high temperature
C
housings.
Figure 1 (continued)
Rev F
3 of 8
108-1092
Test Description
Humidity-temperature cycling.
See Note.
Requirement
Procedure
TE Spec 109-23-3, Condition B.
Subject mated connectors to 10
humidity-temperature cycles
between 25 and 65° at 95% RH.
C
TE Spec 109-85-3.
Subject mated connectors to
environmental class III for 20 days.
TE Spec 109-43.
Subject mated connectors to
temperature life at 105° for 500
C
hours.
Mixed flowing gas.
See Note.
Temperature life.
See Note.
NOTE
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
1
2
3
4
5
6
7
8
Test Sequence (b)
Examination of product
Termination resistance
Dielectric withstanding voltage
Insulation resistance
Temperature rise vs current
Vibration
Physical shock
Mating force
Unmating force
Durability
Solderability
Thermal shock
Humidity-temperature cycling
Mixed flowing gas
Temperature life
NOTE
(a)
(b)
(c)
4
4
3(c)
4
5
5
6
2
8
4
3
3
2
2
4
3
3
1,9
3,7
1,6
2,5
1,6
2,5
1,4
2
1,5
2,4
3,7
2,6
1,8
1,3
1,5
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Precondition samples with 10 cycles durability.
Figure 2
Rev F
4 of 8
108-1092
4.
4.1.
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
Sample Selection
Connector housings and contacts shall be prepared in accordance with applicable Instruction
Sheets and shall be selected at random from current production.
Test groups 1 and 3 shall consist of 5 samples each of 30
µin
gold plating and gold flash of a right
angle receptacle connector. Mating crimp snap plug connectors without grounding indents shall be
loaded with 30
µin
gold plating and gold flash pin contacts as required per Note (a). Crimp snap
contacts shall be double crimped with 2, 12 inch 105° rated PVC 26 AWG wires per Note (b).
C
Cable clamps shall be used on crimp snap connectors. Hardware shall be used to hold mating
connectors together and to secure posted connectors onto printed circuit boards.
Test group 2 shall consist of 5 samples each of 30
µin
gold plated right angle receptacle connector
and gold flash straight posted receptacle connector. Mating crimp snap plug connectors shall be
loaded with 30
µin
gold plating and gold flash pin contacts as required per Note (a). Crimp snap
contacts shall be double crimped with 12 inch 105° rated PVC 26 AWG wires per Note (b).
C
Hardware shall be used to hold mating connectors together and to secure posted connectors onto
printed circuit boards.
Test group 4 shall consist of 5 samples each of right angle receptacle connector and straight
posted receptacle connector with gold flash contacts. Mating crimp snap plug connectors shall be
loaded with gold flash pin contacts. Crimp snap contacts shall be double crimped with 2, 12 inch
105° rated PVC 26 AWG wires per Note (b). Cable cl amps shall be used on crimp snap
C
connectors. Hardware shall be used to hold mating connectors together and to secure posted
connectors onto printed circuit boards.
Test group 5 shall consist of 5 samples each of gold flash right angle receptacle connector and
straight posted receptacle connector. Mating crimp snap plug connectors shall be loaded with gold
flash pin contacts. Crimp snap contacts shall be double crimped with 2, 12 inch 105° rated PVC
C
26 AWG wires per Note (b). Cable clamps shall be used on crimp snap connectors. Hardware
shall be used to hold mating connectors together and to secure posted connectors onto printed
circuit boards.
Test groups 6 and 7 shall each consist of 5 samples of right angle receptacle connector with gold
flash contacts.
Test group 8 shall consist of 5 samples each of size 1 (15 position), size 2 (26 position), size 3 (44
position), size 4 (62 position), and size 5 (78 position) receptacle connectors with gold flash
contacts. Mating crimp snap plug connectors with grounding indents shall be loaded with crimped
contacts with no wires required.
NOTE
(a)
(b)
Gold flash socket contacts shall be mated with gold flash pin contacts. 30 µin gold
socket contacts shall be mated to 30
µin
gold pin contacts.
Strip wires to .250 inch beyond insulation barrel for double crimp to prevent broken
wires. Second wire shall be used to provide voltage drop readings.
B.
Test Sequence
Qualification inspection shall be verified by testing samples as specified in Figure 2.
Rev F
5 of 8
FPGA/CPLD
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