Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDFP14,
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DFP, FL14,.3 |
| Reach Compliance Code | compliant |
| 控制类型 | ENABLE HIGH |
| JESD-30 代码 | R-XDFP-F14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 2A |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 250 |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 74126FCQR | 74126DCQR | 74126DCQM | 74126FCQM | 74126PCQM | 74126PCQR | 54126DMQB | 54126FMQB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDFP14, | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDFP14, | Bus Driver, 1-Func, 4-Bit, True Output, TTL, PDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, TTL, PDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDFP14, |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| 包装说明 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 控制类型 | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH |
| JESD-30 代码 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-PDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDFP-F14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | DFP | DIP | DIP | DFP | DIP | DIP | DIP | DFP |
| 封装等效代码 | FL14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| 峰值回流温度（摄氏度） | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| 表面贴装 | YES | NO | NO | YES | NO | NO | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
