Monostable Multivibrator, TTL, CDIP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74122DCQR | 74122DCQM | WBDDSS8-A-00-2803-D- | WBDDSS8-A-00-5970-C- | 54122FMQB | 54122DMQB | 54122FM | |
|---|---|---|---|---|---|---|---|
| 描述 | Monostable Multivibrator, TTL, CDIP14, | Monostable Multivibrator, TTL, CDIP14, | Array/Network Resistor, Isolated, 0.1W, 280000ohm, 100V, 0.5% +/-Tol, -300,300ppm/Cel, 1408, | Array/Network Resistor, Isolated, 0.1W, 597ohm, 100V, 0.25% +/-Tol, -300,300ppm/Cel, 1408, | Monostable Multivibrator, TTL, CDFP14, | Monostable Multivibrator, TTL, CDIP14, | Monostable Multivibrator, TTL, CDFP14, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | unknown | compliant |
| 端子数量 | 14 | 14 | 16 | 16 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 70 °C | 150 °C | 150 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形式 | IN-LINE | IN-LINE | SMT | SMT | FLATPACK | IN-LINE | FLATPACK |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Fairchild | Fairchild | - | - | Fairchild | Fairchild | - |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | - | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | - | - | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | - | - | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR |
| 封装主体材料 | CERAMIC | CERAMIC | - | - | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | - | - | DFP | DIP | DFP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | - | - | FL14,.3 | DIP14,.3 | FL14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 电源 | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | - | - | YES | NO | YES |
| 技术 | TTL | TTL | - | - | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | - | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | - | FLAT | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | - | - | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | - | - | DUAL | DUAL | DUAL |
| 认证状态 | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
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