IDT has qualified the TSOP package family using new mold compound EME-G700
Material
(Sumitomo) and die attach material 3230 manufactured by (Ablestik). This notification is
Testing
to advise our customer of adding these new assembly materials. Please see attachment for
Manufacturing Site
qualification data and additional details.
Data Sheet
Other
RELIABILITY/QUALIFICATION SUMMARY:
IDT has completed the qualification and the summary of results is attached.
CUSTOMER ACKNOWLEDGMENT OF RECEIPT:
IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail
to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice
it will be assumed that this change is acceptable.
IDT reserves the right to ship either version manufactured after the process change effective date until the inventory
on the earlier version has been depleted.
Customer:
Name/Date:
Title:
CUSTOMER COMMENTS:
Approval for shipments prior to effective date.
E-Mail Address:
Phone# /Fax# :
IDT ACKNOWLEDGMENT OF RECEIPT:
RECD. BY:
IDT FRA-1509-01 REV. 00 09/18/01
DATE:
Page 1 of 8
Refer To QCA-1795
Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT - PCN #: SR-0212-02
PCN Type:
Data Sheet Change:
Detail Of Change:
To qualify new mold compound EME-G700 and die attach 3230 material.
None
A new mold compound and die attach material has been qualified for TSOP package
family. The details are as follow:
Material
Description
Old
Die attach material
Mold compound
material
Ablestik 8340, 8390,
84-1LMISR4
Shinetsu KMC 184
Sumitomo 6300 series
7351LP and 7320CR
New
Ablestik 3230
Sumitomo EME-G700 series
The list of the products effected are as follows:
71016S12PH
71016S15PH
71016S20PH
71016S12PHI
71016S15PHI
71016S20PHI
71T016SA10PH
71T016SA12PH
71T016SA15PH
71T016SA20PH
71T016SA10PHI
71T016SA12PHI
71T016SA15PHI
71T016SA10PH
71T016SA12PH
71T016SA15PH
71T016SA20PH
71T016SA10PHI
71T016SA12PHI
71T016SA15PHI
71T016SA20PHI
71V416S10PH
71V416S12PH
71V416S15PH
71V416S10PHI
71V416S12PHI
71V416S15PHI
71V416L10PH
71V416L12PH
71V416L15PH
71V416L10PHI
71V416L12PHI
71V416L15PHI
71V424S10PH
71V424S12PH
71V424S15PH
71V424S10PHI
71V424S12PHI
71V424S15PHI
71V424L10PH
71V424L12PH
71V424L15PH
71V424L10PHI
71V424L12PHI
71V424L15PHI
71256SA10PZ
71256SA15PZ
71256SA20PZ
71256SA25PZ
71256SA10PZI
71256SA15PZI
71256SA20PZI
71256SA25PZI
Conversion schedule (Estimated):
Please contact your local field sales representative for sample availability and production shipments.
Page 2 of 8
Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT - PCN #: SR-0212-02
Qualification Results:
Qualification Plan #:
Test Vehicle:
P02-08-01
IDT71V416
Test Methods
Highly Accelerated Stress Test (HAST)
(100 Hrs, @130° C/85%RH,Static Bias)
Life Test (Dynamic B/I, Vcc=4.00V, TA=135ºC)
+ end point electrical test, 750 hours or equivalent
Temperature Cycling, (-65° C to +150° C, 500 cyc)
Auto Clave (SPP), (168Hrs, @ 2ATM, 121° C)
High Temp Bake, 150º C, 1000 hours
Package Moisture Characterization
Internal Visual Inspection
External Visual Inspection
X-ray Examination
Bond Pull Test
Bake & Ball Shear Test
Physical Dimensions
Resistance to Solvents
Solderability Test
Die Shear Test
Sample size
/# of Fails
45/0
77/0
45/0
45/0
77/0
45/0
(2 lots)
5/0
25/0
45/0
5/0
5/0
5/0
3/0
5/0
5/0
Test Results
SS /# of Fails
45/0
76/0 (a)
44/0 (a)
45/0
77/0
45/0
(2 lots)
5/0
25/0
45/0
5/0
5/0
5/0
3/0
5/0
5/0
EIA/JESD22-A110
MIL-STD-883, Method 1005
MIL-STD-883, Method 1010
EIA/JESD22-A102
MIL-STD-883, Method 1008
JEDEC J-STD-20
MIL-STD-883, Method 2010
MIL-STD-883, Method 2009
Per IDT specification
MIL-STD-883, Method 2011
EIA/JESD22-B116
MIL-STD-883, Method 2016
MIL-STD-883, Method 2015
MIL-STD-883, Method 2003
MIL-STD-883, Method 2019
Notes:
There is no change in Moisture Sensitivity Level.
(a) Mechanical rejects (broken leads).
Page 3 of 8
SUMITOMO BAKELITE
EME-G700
MULTI-AROMATIC RESIN
Br/Sb FREE
FOR Pb FREE PKG
LOW WATER ABSORPTION
SUMIKON
EME-G700
TYPICAL PROPERTIES:
ITEM
SPIRAL FLOW
GEL TIME (at 175
°
C)
THERMAL EXPANSION
∝
1
THERMAL EXPANSION
∝
2
Tg
THERMAL CONDUCTIVITY
FLEXURAL STRENGTH
(at 25
°
C)
(at 240
°
C)
FLEXURAL MODULUS
(at 25
°
c)
(at 240
°
C)
SPECIFIC GRAVITY
VOLUME RESISTIVITY
(at 150
°
c)
UL FLAME CLASS
WATER ABSORPTION
(boiling, 24 h)
EXTRACTED Na
+
EXTRACTED Cl
-
TEST METHOD
SB-U-03-003
SB-U-03-005
SB-U-02-002
SB-U-02-002
SB-U-02-002
SB-U-02-004
SB-U-01-001
UNIT
cm
sec
X 10
-5
1/
°
C
X 10
-5
1/
°
C
°
C
W/m
•
°
C
N/ mm
2
VALUES
110
30
1.2
4.9
130
88x 10
-2
170
21
SB-U-01-002
X 10
2
N/mm
2
SB-U-03-018
SB-U-00-004
SB-U-03-003
SB-U-03-002
SB-U-04-043
SB-U-04-043
--------------
Ω
- cm
UL-94
% weight gain
ppm
ppm
190
6.0
1.95
1 x 10
12
V-0
0.15
1
5
TYPICAL, NOT GUARANTEED PROPERTIES
MOLDING AND POST MOLD CURE CONDITIONS:
STANDARD
6
80 x10 Pa
180
°
C
A/90 sec
175
°
C
6h
RANGE
6
70-120 x10 Pa
175-185
°
C
70-120 sec
170-180
°
C
4-8 h
rev. Nov.’00
TRANSFER PRESSURE
MOLD TEMPERATURE
CURE TIME (C or A)
#
POST-MOLD CURE TEMP
POST-MOLD CURE TIME
#Conventional or Auto
The information contained herein is true and accurate to our best knowledge. Sumitomo Bakelite Co., makes no warranty or guarantee of results and assumes no obligation or
liabilities from the use of any products mentioned herein. This publication is not to be taken as license to operate under or recommendations to infringe upon any patents.
SUMITOMO BAKELITE CO., LTD.
Tennoz Parkside Building, 5-8 Higashi-Shinagawa, 2-Chome Shinagawa-ku, Tokyo 140, Japan
ABLEBOND
®
3230
LOW STRESS CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND
®
3230 low stress, electrically
conductive die attach adhesive is designed for
high reliability packaging applications. This
electrically conductive adhesive offers
FEATURES
• Low stress
• Improved JEDEC performance
• Fast oven cure
• Excellent adhesion to copper
TEST
METHOD
improved JEDEC performance, fast oven
cure, and excellent adhesion to copper. It
can be used in various package sizes.
TYPICAL UNCURED PROPERTIES
Filler Type
Viscosity @ 25°C
Thixotropic Index
Estimated Work Life @ 25
o
C
Estimated Storage Life @ -40
o
C
Silver
9,000 cps
5.6
24 hours
1 year
TEST DESCRIPTION
Brookfield CP-51 @ 5 rpm
Viscosity @ 0.5/Viscosity @ 5 rpm
25% increase in viscosity @ RT
PT-42
PT-61
PT-59
PT-13
CURE PROCESS DATA
Weight Loss on cure
Recommended Cure Condition
3.9%
10 x 10 mm Si die on glass slide
PT-80
30 minute ramp to 175°C; hold at 175°C for 15 minutes
Typical properties are not intended to be used as specification limits. If you need to write a specifi-
cation, please request our Standard Release Specification.
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