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74AC151SCQR

产品描述IC AC SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16, SOIC-16, Multiplexer/Demultiplexer
产品类别逻辑    逻辑   
文件大小171KB,共10页
制造商National Semiconductor(TI )
官网地址http://www.ti.com
敬请期待 详细参数 选型对比

74AC151SCQR概述

IC AC SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16, SOIC-16, Multiplexer/Demultiplexer

74AC151SCQR规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称National Semiconductor(TI )
包装说明SOP, SOP16,.25
Reach Compliance Codeunknown
系列AC
JESD-30 代码R-PDSO-G16
JESD-609代码e0
长度9.9 mm
负载电容(CL)50 pF
逻辑集成电路类型MULTIPLEXER
最大I(ol)0.012 A
功能数量1
输入次数8
输出次数1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
输出极性COMPLEMENTARY
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP16,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3/5 V
Prop。Delay @ Nom-Sup16 ns
传播延迟(tpd)15 ns
认证状态Not Qualified
座面最大高度1.75 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3.9 mm
Base Number Matches1

74AC151SCQR相似产品对比

74AC151SCQR 54ACT151FMQB 54ACT151LMQB 54AC151LMQB 74ACT151FCQR 74ACT151PCQR 74AC151PCQR 74ACT151SCQR 74ACT151LCQR
描述 IC AC SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16, SOIC-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer IC AC SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, Multiplexer/Demultiplexer IC AC SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16, SOIC-16, Multiplexer/Demultiplexer IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer
包装说明 SOP, SOP16,.25 DFP, FL16,.3 QCCN, LCC20,.35SQ QCCN, LCC20,.35SQ CERAMIC, FP-16 DIP, DIP16,.3 PLASTIC, DIP-16 SOP, SOP16,.25 CERAMIC, LCC-20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
系列 AC ACT ACT AC ACT ACT AC ACT ACT
JESD-30 代码 R-PDSO-G16 R-GDFP-F16 S-CQCC-N20 S-CQCC-N20 R-GDFP-F16 R-PDIP-T16 R-PDIP-T16 R-PDSO-G16 S-CQCC-N20
长度 9.9 mm 9.6645 mm 8.89 mm 8.89 mm 9.6645 mm 19.305 mm 19.305 mm 9.9 mm 8.89 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER
功能数量 1 1 1 1 1 1 1 1 1
输入次数 8 8 8 8 8 8 8 8 8
输出次数 1 1 1 1 1 1 1 1 1
端子数量 16 16 20 20 16 16 16 16 20
最高工作温度 85 °C 125 °C 125 °C 125 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -55 °C -55 °C -55 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
封装主体材料 PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
封装代码 SOP DFP QCCN QCCN DFP DIP DIP SOP QCCN
封装形状 RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 SMALL OUTLINE FLATPACK CHIP CARRIER CHIP CARRIER FLATPACK IN-LINE IN-LINE SMALL OUTLINE CHIP CARRIER
传播延迟(tpd) 15 ns 16 ns 16 ns 18 ns 16.5 ns 16.5 ns 15 ns 16.5 ns 16.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.75 mm 2.032 mm 1.905 mm 1.905 mm 2.032 mm 5.08 mm 5.08 mm 1.75 mm 1.905 mm
最大供电电压 (Vsup) 6 V 5.5 V 5.5 V 6 V 5.5 V 5.5 V 6 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 4.5 V 4.5 V 2 V 4.5 V 4.5 V 2 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 3 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES NO NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL MILITARY MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING FLAT NO LEAD NO LEAD FLAT THROUGH-HOLE THROUGH-HOLE GULL WING NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL QUAD QUAD DUAL DUAL DUAL DUAL QUAD
宽度 3.9 mm 6.604 mm 8.89 mm 8.89 mm 6.604 mm 7.62 mm 7.62 mm 3.9 mm 8.89 mm
是否Rohs认证 不符合 不符合 不符合 不符合 - 不符合 不符合 不符合 -
厂商名称 National Semiconductor(TI ) - - - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
JESD-609代码 e0 e0 e0 e0 - e0 e0 e0 -
最大I(ol) 0.012 A 0.024 A 0.024 A 0.012 A - 0.024 A 0.012 A 0.024 A -
封装等效代码 SOP16,.25 FL16,.3 LCC20,.35SQ LCC20,.35SQ - DIP16,.3 DIP16,.3 SOP16,.25 -
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
电源 3.3/5 V 5 V 5 V 3.3/5 V - 5 V 3.3/5 V 5 V -
Prop。Delay @ Nom-Sup 16 ns 16 ns 16 ns 18 ns - 14 ns 16 ns 14 ns -
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Base Number Matches 1 1 1 1 1 1 1 1 -

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