IC HC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, SOT-109, SOP-16, Multiplexer/Demultiplexer
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | HC |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 9.9 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 传播延迟（tpd） | 38 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| 74HC157D/T3 | 74HCT157PW-T | 74HC157DB-T | 74HC157PW-T | 74HCT157DB-T | 74HCT157NB | 74HC157NB | |
|---|---|---|---|---|---|---|---|
| 描述 | IC HC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, SOT-109, SOP-16, Multiplexer/Demultiplexer | 编码器、解码器、复用器和解复用器 quad 2-input multiplexer | 编码器、解码器、复用器和解复用器 quad 2-input multiplexer | 编码器、解码器、复用器和解复用器 quad 2-input multiplexer | 编码器、解码器、复用器和解复用器 quad 2-input multiplexer | IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDIP16, Multiplexer/Demultiplexer | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDIP16 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | SOP, | TSSOP, | SSOP, | TSSOP, | 5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16 | DIP, | DIP, |
| Reach Compliance Code | unknown | unknow | unknow | unknow | unknow | unknown | unknown |
| 系列 | HC | HCT | HC/UH | HC/UH | HCT | HCT | HC/UH |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 |
| 长度 | 9.9 mm | 5 mm | 6.2 mm | 5 mm | 6.2 mm | 19.025 mm | 19.025 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | SSOP | TSSOP | SSOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 38 ns | 56 ns | 38 ns | 38 ns | 56 ns | 56 ns | 38 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.1 mm | 2 mm | 1.1 mm | 2 mm | 4.2 mm | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 6 V | 6 V | 5.5 V | 5.5 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 2 V | 2 V | 4.5 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 4.4 mm | 5.3 mm | 4.4 mm | 5.3 mm | 7.62 mm | 7.62 mm |
| 零件包装代码 | SOIC | TSSOP | SSOP | TSSOP | SSOP | - | - |
| 针数 | 16 | 16 | 16 | 16 | 16 | - | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | e4 |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD |
| Base Number Matches | 1 | - | 1 | 1 | - | 1 | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | - | 符合 |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | - | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | - | 245 |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 | - | 40 |
Microchip MCU
嵌入式系统
模拟与混合信号
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