CPACK-24, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | CPACK |
| 包装说明 | DFP, FL24,.4 |
| 针数 | 24 |
| 制造商包装代码 | CP24 |
| Reach Compliance Code | not_compliant |
| 其他特性 | WITH DUAL OUTPUT ENABLE |
| 控制类型 | ENABLE LOW |
| 系列 | FCT |
| JESD-30 代码 | R-GDFP-F24 |
| JESD-609代码 | e0 |
| 长度 | 15.748 mm |
| 负载电容（CL） | 300 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 5 ns |
| 传播延迟（tpd） | 11 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 9.144 mm |
| Base Number Matches | 1 |
| 5962-9224705MKA | 5962-9224703MKX | 5962-9224703M3X | 5962-9224701MKA | 5962-9224703MKA | 5962-9224703MLX | |
|---|---|---|---|---|---|---|
| 描述 | CPACK-24, Tube | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CQCC28, LCC-28 | CPACK-24, Tube | CPACK-24, Tube | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDIP24, 0.300 INCH, CERDIP-24 |
| 零件包装代码 | CPACK | DFP | QLCC | CPACK | CPACK | DIP |
| 包装说明 | DFP, FL24,.4 | DFP, | QCCN, | DFP, FL24,.4 | DFP, FL24,.4 | DIP, |
| 针数 | 24 | 24 | 28 | 24 | 24 | 24 |
| Reach Compliance Code | not_compliant | unknow | unknown | not_compliant | not_compliant | unknown |
| 其他特性 | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDFP-F24 | R-GDFP-F24 | S-CQCC-N28 | R-GDFP-F24 | R-GDFP-F24 | R-GDIP-T24 |
| 长度 | 15.748 mm | 15.748 mm | 11.4554 mm | 15.748 mm | 15.748 mm | 32.004 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 28 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DFP | QCCN | DFP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE |
| 传播延迟（tpd） | 11 ns | 14 ns | 14 ns | 17 ns | 14 ns | 14 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 2.286 mm | 2.286 mm | 2.54 mm | 2.286 mm | 2.286 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | NO LEAD | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 9.144 mm | 9.144 mm | 11.4554 mm | 9.144 mm | 9.144 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - |
| 峰值回流温度（摄氏度） | 260 | - | - | 260 | 260 | NOT SPECIFIED |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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