Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CQCC28, LCC-28
参数名称 | 属性值 |
零件包装代码 | QLCC |
包装说明 | QCCN, |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
其他特性 | WITH DUAL OUTPUT ENABLE |
系列 | FCT |
JESD-30 代码 | S-CQCC-N28 |
JESD-609代码 | e0 |
长度 | 11.4554 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 10 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 28 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
传播延迟(tpd) | 14 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 |
座面最大高度 | 2.54 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 11.4554 mm |
Base Number Matches | 1 |
5962-9224703M3X | 5962-9224703MKX | 5962-9224701MKA | 5962-9224703MKA | 5962-9224703MLX | 5962-9224705MKA | |
---|---|---|---|---|---|---|
描述 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CQCC28, LCC-28 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24 | CPACK-24, Tube | CPACK-24, Tube | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | CPACK-24, Tube |
零件包装代码 | QLCC | DFP | CPACK | CPACK | DIP | CPACK |
包装说明 | QCCN, | DFP, | DFP, FL24,.4 | DFP, FL24,.4 | DIP, | DFP, FL24,.4 |
针数 | 28 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknow | not_compliant | not_compliant | unknown | not_compliant |
其他特性 | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
系列 | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | S-CQCC-N28 | R-GDFP-F24 | R-GDFP-F24 | R-GDFP-F24 | R-GDIP-T24 | R-GDFP-F24 |
长度 | 11.4554 mm | 15.748 mm | 15.748 mm | 15.748 mm | 32.004 mm | 15.748 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 10 | 10 | 10 | 10 | 10 | 10 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 28 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DFP | DFP | DFP | DIP | DFP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK | IN-LINE | FLATPACK |
传播延迟(tpd) | 14 ns | 14 ns | 17 ns | 14 ns | 14 ns | 11 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
座面最大高度 | 2.54 mm | 2.286 mm | 2.286 mm | 2.286 mm | 5.08 mm | 2.286 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | FLAT | FLAT | FLAT | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 11.4554 mm | 9.144 mm | 9.144 mm | 9.144 mm | 7.62 mm | 9.144 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD |
峰值回流温度(摄氏度) | - | - | 260 | 260 | NOT SPECIFIED | 260 |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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