Hermetically Sealed, High Speed, High CMR,
Logic Gate Optocouplers
Data Sheet
6N134,* 81028, HCPL-563X, HCPL-663X, HCPL-565X, 5962-98001,
HCPL-268K, HCPL-665X, 5962-90855, HCPL-560X
*See matrix for available extensions.
Description
These units are single, dual and quad channel,
hermetically sealed optocouplers. The products are
capable of operation and storage over the full military
temperature range and can be purchased as either
standard product or with full MIL-PRF-38534 Class Level
H or K testing or from the appropriate DSCC Drawing. All
devices are manufactured and tested on a MIL-PRF-38534
certified line and are included in the DSCC Qualified
Manufacturers List QML-38534 for Hybrid Microcircuits.
Quad channel devices are available by special order in
the 16 pin DIP through hole packages.
Features
• Dual marked with device part number and DSCC
drawing number
• Manufactured and tested on a MIL-PRF-38534
Certified Line
• QML-38534, Class H and K
• Five hermetically sealed package configurations
• Performance guaranteed over full military
temperature range: -55°C to +125°C
• High speed: 10 M Bit/s
• CMR: > 10,000 V/µs typical
• 1500 Vdc withstand test voltage
• 2500 Vdc withstand test voltage for HCPL-565X
• High radiation immunity
• 6N137, HCPL-2601, HCPL-2630/-31 function
compatibility
• Reliability data
• TTL circuit compatibility
Truth Table
(Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
Output
L
H
Applications
•
•
•
•
•
•
•
•
•
•
Military and space
High reliability systems
Transportation, medical, and life critical systems
Line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Isolation for computer, communication, and test
equipment systems
Single Channel DIP
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
L
H
H
H
Functional Diagram
Multiple channel devices available
V
CC
V
E
V
OUT
GND
The connection of a 0.1
µ
F bypass capacitor between V
CC
and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage
and/or degradation which may be induced by ESD.
Each channel contains a GaAsP light emitting diode which
is optically coupled to an integrated high speed photon
detector. The output of the detector is an open collector
Schottky clamped transistor. Internal shields provide a
guaranteed common mode transient immunity
specification of 1000 V/µs. For Isolation Voltage
applications requiring up to 2500 Vdc, the HCPL-5650
family is also available. Package styles for these parts are
8 and 16 pin DIP through hole (case outlines P and E
respectively), and 16 pin surface mount DIP flat pack
(case outline F), leadless ceramic chip carrier (case outline
2). Devices may be purchased with a variety of lead bend
and plating options. See Selection Guide Table for details.
Standard Microcircuit Drawing (SMD) parts are available
for each package and lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this data
sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and
performance characteristics shown in the figures are
identical for all parts. Occasional exceptions exist due to
package variations and limitations, and are as noted.
Additionally, the same package assembly processes and
materials are used in all devices. These similarities give
justification for the use of data obtained from one part to
represent other parts’ performance for reliability and
certain limited radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel
Wiring
Withstand Test Voltage
Avago Part # & Options
16 Pin DIP
Through Hole
2
V
CC
, GND
1500 Vdc
6N134
[1]
6N134/883B
HCPL-268K
Gold Plate
Option #200
Option #100
Option #300
None
8102801EX
8102801EC
8102801EA
8102801UC
8102801UA
8102801TA
5962-
9800101KEX
9800101KEC
9800101KEA
9800101KUC
9800101KUA
9800101KTA
8 Pin DIP
Through Hole
1
None
1500 Vdc
HCPL-5600
HCPL-5601
HCPL-560K
Gold Plate
Option #200
Option #100
Option #300
5962-
9085501HPX
9085501HPC
9085501HPA
9085501HYC
9085501HYA
9085501HXA
5962-
9085501KPX
9085501KPC
9085501KPA
9085501KYC
9085501KYA
9085501KXA
8 Pin DIP
Through Hole
2
V
CC
, GND
1500 Vdc
HCPL-5630
HCPL-5631
HCPL-563K
Gold Plate
Option #200
Option #100
Option #300
None
8102802PX
8102802PC
8102802PA
8102802YC
8102802YA
8102802ZA
5962-
9800102KPX
9800102KPC
9800102KPA
9800102KYC
9800102KYA
9800102KZA
8 Pin DIP
Through Hole
2
V
CC
, GND
2500 Vdc
HCPL-5650
HCPL-5651
Gold Plate
Option #200
16 Pin Flat Pack
Unformed Leads
4
V
CC
, GND
1500 Vdc
HCPL-6650
HCPL-6651
HCPL-665K
Gold Plate
20 Pad LCCC
Surface Mount
2
None
1500 Vdc
HCPL-6630
HCPL-6631
HCPL-663K
Solder Pads*
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped*
Butt Cut/Gold Plate
Gull Wing/Soldered*
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
Class K SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
*Solder contains lead.
Note:
1. JEDEC registered part.
None
8102805PX
8102805PC
8102805PA
None
8102804FX
8102804FC
None
81028032X
81028032A
5962-
9800104KFX
9800104KFC
5962-
9800103K2X
9800103K2A
2
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
2
3
4
5
6
7
8
GND
V
O2
V
CC
V
O1
16
15
14
13
12
11
10
9
3
4
1
2
V
CC
V
E
V
OUT
6
5
8
7
1
V
CC
V
O1
V
O2
8
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
2
3
4
6
20 Pad LCCC
Surface Mount
2 Channels
16
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
13
12
11
10
9
2
3
19
20
15
V
CC2
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
2
3
4
7
5
GND
5
10
6
7
8
GND
Note:
All DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic chip carrier)
package has isolated channels with separate V
CC
and ground connections. All diagrams are “top view.”
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.51 (0.020)
MIN.
;;;;;
0.89 (0.035)
1.65 (0.065)
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Avago LOGO
Avago P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
* 50434
COUNTRY OF MFR.
Avago CAGE CODE*
* QUALIFIED PARTS ONLY
8.13 (0.320)
MAX.
4.45 (0.175)
MAX.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Leaded Device Marking
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
Leadless Device Marking
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
* XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Avago CAGE CODE*
* QUALIFIED PARTS ONLY
3
Outline Drawings (continued)
;;;; ;;;;
;;
;
;;
;
9.40 (0.370)
9.91 (0.390)
8.13 (0.320)
MAX.
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
7.16 (0.282)
7.57 (0.298)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MIN.
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
2.29 (0.090)
2.79 (0.110)
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8 Pin DIP Through Hole, 1 and 2 Channels
8 Pin DIP Through Hole, 2 Channels
2500 Vdc Withstand Test Voltage
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
5.08 (0.200)
MAX.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
16 Pin Flat Pack, 4 Channels
11.13 (0.438)
10.72 (0.422)
2.85 (0.112)
MAX.
;;
;;;
;;;
7.24 (0.285)
6.99 (0.275)
8.13 (0.320)
MAX.
5.23
(0.206)
MAX.
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
2.29 (0.090)
MAX.
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
1.27 (0.050)
REF.
1.78 (0.070)
2.03 (0.080)
0.46 (0.018)
0.36 (0.014)
1.52 (0.060)
2.03 (0.080)
0.31 (0.012)
0.23 (0.009)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
0.89 (0.035)
0.69 (0.027)
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
4.32 (0.170)
MAX.
;;;;;
;
;;;
;
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
4.57 (0.180)
MAX.
300
0.51 (0.020)
MIN.
;;;;;
;;;;
;;;
;;;
0.51 (0.020)
MAX.
1.40 (0.055)
1.65 (0.065)
4.57 (0.180)
MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
1.40 (0.055)
1.65 (0.065)
5° MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Solder contains lead.
5
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
