EE PLD, 9ns, CMOS, CDIP20, CERDIP-20
| 参数名称 | 属性值 |
| 厂商名称 | Lattice(莱迪斯) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | 1 EXTERNAL CLOCK; REGISTER PRELOAD |
| 最大时钟频率 | 76.9 MHz |
| JESD-30 代码 | R-GDIP-T20 |
| 长度 | 25.27 mm |
| 专用输入次数 | 8 |
| I/O 线路数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8983907RX | 5962-89839072B | 5962-89839072X | 5962-8983901RX | GAL16V8B-10LR/883 | GAL16V8B-10LD/883 | |
|---|---|---|---|---|---|---|
| 描述 | EE PLD, 9ns, CMOS, CDIP20, CERDIP-20 | EE PLD, 9ns, CMOS, CQCC20, LCC-20 | EE PLD, 7.5ns, CMOS, CQCC20, LCC-20 | EE PLD, 30ns, CMOS, CDIP20, CERDIP-20 | EE PLD, 10ns, PAL-Type, CMOS, CQCC20, LCC-20 | EE PLD, 10ns, PAL-Type, CMOS, CDIP20, 0.300 INCH, CERDIP-20 |
| 零件包装代码 | DIP | QLCC | QLCC | DIP | QLCC | DIP |
| 包装说明 | DIP, | QCCN, | QCCN, | DIP, | LCC-20 | 0.300 INCH, CERDIP-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | 1 EXTERNAL CLOCK; REGISTER PRELOAD | 1 EXTERNAL CLOCK; REGISTER PRELOAD | 8 OUTPUT LOGIC MACROCELLS | 1 EXTERNAL CLOCK; REGISTER PRELOAD | 1 EXTERNAL CLOCK; REGISTER PRELOAD | 1 EXTERNAL CLOCK; REGISTER PRELOAD |
| 最大时钟频率 | 76.9 MHz | 76.9 MHz | 76.9 MHz | 22.2 MHz | 58.8 MHz | 58.8 MHz |
| JESD-30 代码 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 |
| 长度 | 25.27 mm | 8.89 mm | 8.89 mm | 25.27 mm | 8.89 mm | 25.273 mm |
| 专用输入次数 | 8 | 8 | 8 | 8 | 8 | 8 |
| I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCN | QCCN | DIP | QCCN | DIP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 9 ns | 9 ns | 7.5 ns | 30 ns | 10 ns | 10 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.2606 mm | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL |
| 宽度 | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm |
| 厂商名称 | Lattice(莱迪斯) | Lattice(莱迪斯) | - | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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