Standard SRAM, 32KX8, 20ns, CMOS, CQCC32
| 参数名称 | 属性值 |
| 厂商名称 | LOGIC Devices |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 20 ns |
| JESD-30 代码 | R-CQCC-N32 |
| JESD-609代码 | e0 |
| 长度 | 13.97 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 32KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |
| 5962-8866207YA | 5962-8866205UA | 5962-8866205YA | 5962-8866206YA | 5962-8866206UA | 5962-8866207UA | |
|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 32KX8, 20ns, CMOS, CQCC32 | Standard SRAM, 32KX8, 35ns, CMOS, CQCC28 | Standard SRAM, 32KX8, 35ns, CMOS, CQCC32 | Standard SRAM, 32KX8, 25ns, CMOS, CQCC32 | Standard SRAM, 32KX8, 25ns, CMOS, CQCC28 | Standard SRAM, 32KX8, 20ns, CMOS, CQCC28 |
| 包装说明 | QCCN, | QCCN, | QCCN, | QCCN, | QCCN, LCC28,.35X.55 | QCCN, LCC28,.35X.55 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 20 ns | 35 ns | 35 ns | 25 ns | 25 ns | 20 ns |
| JESD-30 代码 | R-CQCC-N32 | R-CQCC-N28 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N28 | R-CQCC-N28 |
| 长度 | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 28 | 32 | 32 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | QCCN | QCCN | QCCN | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 3.048 mm | 3.048 mm | 3.048 mm | 3.048 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 11.43 mm | 8.89 mm | 11.43 mm | 11.43 mm | 8.89 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | LOGIC Devices | - | - | LOGIC Devices | LOGIC Devices | LOGIC Devices |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped | - |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | 225 | 225 |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
FPGA/CPLD
模拟电子
单片机
嵌入式系统
FPGA/CPLD
国产芯片交流
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
