1M-BIT [64K x 16] CMOS MASK ROM

| MX23C1024 | MX23C1024PC-15 | MX23C1024PC-12 | MX23C1024PC-20 | MX23C1024QC-20 | MX23C1024QC-15 | MX23C1024QC-12 | |
|---|---|---|---|---|---|---|---|
| 描述 | 1M-BIT [64K x 16] CMOS MASK ROM | 1M-BIT [64K x 16] CMOS MASK ROM | 1M-BIT [64K x 16] CMOS MASK ROM | 1M-BIT [64K x 16] CMOS MASK ROM | 1M-BIT [64K x 16] CMOS MASK ROM | 1M-BIT [64K x 16] CMOS MASK ROM | 1M-BIT [64K x 16] CMOS MASK ROM |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| 零件包装代码 | - | DIP | DIP | DIP | LPCC | LPCC | LPCC |
| 包装说明 | - | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ |
| 针数 | - | 40 | 40 | 40 | 44 | 44 | 44 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | - | 150 ns | 120 ns | 200 ns | 200 ns | 150 ns | 120 ns |
| JESD-30 代码 | - | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | - | 52.07 mm | 52.07 mm | 52.07 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |
| 内存密度 | - | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | - | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 40 | 40 | 40 | 44 | 44 | 44 |
| 字数 | - | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | - | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | - | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | DIP | DIP | DIP | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | - | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 4.9022 mm | 4.9022 mm | 4.9022 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大待机电流 | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | - | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | NO | NO | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 15.24 mm | 15.24 mm | 15.24 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |
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