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89HPES24T6G2ZCALI8

产品描述FCBGA-324, Reel
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共55页
制造商IDT (Integrated Device Technology)
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89HPES24T6G2ZCALI8概述

FCBGA-324, Reel

89HPES24T6G2ZCALI8规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
针数324
制造商包装代码AL324
Reach Compliance Codenot_compliant
ECCN代码EAR99
JESD-30 代码S-PBGA-B324
JESD-609代码e0
湿度敏感等级4
端子数量324
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源1,3.3 V
认证状态Not Qualified
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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24-Lane 6-Port
Gen2 PCI Express® Switch
®
89HPES24T6G2
Data Sheet
The 89HPES24T6G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T6G2 is a 24-lane, 6-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and up to five
downstream ports and supports switching between downstream ports.
Device Overview
Features
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to six switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
6-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
(Port 0)
(Port 1)
Figure 1 Internal Block Diagram
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 54
April 30, 2013
DSC 6930

89HPES24T6G2ZCALI8相似产品对比

89HPES24T6G2ZCALI8 89HPES24T6G2ZBALG8 89HPES24T6G2ZBALG 89HPES24T6G2ZCALG8 89HPES24T6G2ZCAL8
描述 FCBGA-324, Reel FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 不含铅 含铅
是否Rohs认证 不符合 符合 符合 符合 不符合
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA
针数 324 324 324 324 324
制造商包装代码 AL324 ALG324 ALG324 ALG324 AL324
Reach Compliance Code not_compliant compliant compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e0 e1 e1 e1 e0
湿度敏感等级 4 4 4 4 4
端子数量 324 324 324 324 324
最高工作温度 85 °C 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 260 260 260 225
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - -
包装说明 - FCBGA-324 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324 BGA, BGA324,18X18,40 FCBGA-324
总线兼容性 - PCI; SMBUS PCI PCI; SMBUS PCI; SMBUS
最大时钟频率 - 100 MHz 125 MHz 100 MHz 100 MHz
长度 - 19 mm 19 mm 19 mm 19 mm
座面最大高度 - 3.42 mm 3.42 mm 3.42 mm 3.42 mm
最大供电电压 - 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 - 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 - 1 V 1 V 1 V 1 V
宽度 - 19 mm 19 mm 19 mm 19 mm

 
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