电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

89HPES24T6G2ZBALG

产品描述FCBGA-324, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共55页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

89HPES24T6G2ZBALG在线购买

供应商 器件名称 价格 最低购买 库存  
89HPES24T6G2ZBALG - - 点击查看 点击购买

89HPES24T6G2ZBALG概述

FCBGA-324, Tray

89HPES24T6G2ZBALG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324
针数324
制造商包装代码ALG324
Reach Compliance Codecompliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e1
长度19 mm
湿度敏感等级4
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
电源1,3.3 V
认证状态Not Qualified
座面最大高度3.42 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档预览

下载PDF文档
24-Lane 6-Port
Gen2 PCI Express® Switch
®
89HPES24T6G2
Data Sheet
The 89HPES24T6G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T6G2 is a 24-lane, 6-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and up to five
downstream ports and supports switching between downstream ports.
Device Overview
Features
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to six switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
6-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
(Port 0)
(Port 1)
Figure 1 Internal Block Diagram
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 54
April 30, 2013
DSC 6930

89HPES24T6G2ZBALG相似产品对比

89HPES24T6G2ZBALG 89HPES24T6G2ZBALG8 89HPES24T6G2ZCALI8 89HPES24T6G2ZCALG8 89HPES24T6G2ZCAL8
描述 FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Reel FCBGA-324, Reel FCBGA-324, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅 含铅 不含铅 含铅
是否Rohs认证 符合 符合 不符合 符合 不符合
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA
针数 324 324 324 324 324
制造商包装代码 ALG324 ALG324 AL324 ALG324 AL324
Reach Compliance Code compliant compliant not_compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e1 e1 e0 e1 e0
湿度敏感等级 4 4 4 4 4
端子数量 324 324 324 324 324
最高工作温度 70 °C 70 °C 85 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 260 225 260 225
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - -
包装说明 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324 FCBGA-324 - BGA, BGA324,18X18,40 FCBGA-324
总线兼容性 PCI PCI; SMBUS - PCI; SMBUS PCI; SMBUS
最大时钟频率 125 MHz 100 MHz - 100 MHz 100 MHz
长度 19 mm 19 mm - 19 mm 19 mm
座面最大高度 3.42 mm 3.42 mm - 3.42 mm 3.42 mm
最大供电电压 1.1 V 1.1 V - 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V - 0.9 V 0.9 V
标称供电电压 1 V 1 V - 1 V 1 V
宽度 19 mm 19 mm - 19 mm 19 mm
SMT-PCB设计原则
  一、SMT-PCB上元器件的布局当电路板放到回流焊接炉的传送带上时,元器件的长轴应该与设备的传动方向垂直,这样可以防止在焊接过程中出现元器件在板上漂移或“竖碑”的现象。   PCB上 ......
ESD技术咨询 PCB设计
MSP430G2553按键中断问题
MSP430G2553除了P1.3口具有按键中断能力,可以外接一个按键作为中断吗?可以用中断的方法写程序吗?而不是用查询法。...
芯风作浪 微控制器 MCU
【创龙TL570x-EVM】测评05 Linux应用开发手册
【创龙TL570x-EVM】测评05 Linux应用开发手册 一、Linux应用开发案例的学习 610849 实操测试 个人在实际使用的过程当中与其开发手册有一点明显区别,就是路径不同,开发手册教 ......
小火苗 DSP 与 ARM 处理器
[转帖]ARM 集成开发工具介绍
希望对刚开始学嵌入式,需要用到ADS的朋友有所帮助 本文转引自 飞凌嵌入式 技术论坛 http://www.witech.com.cn/ ARM ADS 全称为 ARM Developer Suite 。是 ARM 公司推出的新一代 ARM ......
吴通凯 ARM技术
如果先学C++好吗
现在我只会汇编,想学C++ 因为听说C++可以编写所有的程序 我有一点C的基础,但只是在学校的一点皮毛 现在想自学C++,不知道会不会很困难?? 希望大家给点意见...
workinchina 嵌入式系统
soso 姐带你逛IC China 2020
昨天上午(10月14日),以“开放发展 合作共赢——5G时代‘芯’动能”为主题的第三届全球IC企业家大会暨第十八届中国国际半导体博览会(IC China2020)在上海开 ......
eric_wang 汽车电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1252  1662  250  2104  2083  56  48  40  27  54 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved