Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> 935320274557

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935320274557: 产品描述RISC Microcontroller; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小894KB，共74页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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935320274557概述

RISC Microcontroller

935320274557规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
包装说明	,
Reach Compliance Code	unknown
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC
Base Number Matches	1

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Kinetis K22F微控制器集成USB LS/FS OTG 2.0接口，内建3.3V收发器，支持crystal-less功能，简化了连接设计。核心采用100 MHz ARM Cortex-M4 with FPU，提供高效数据处理能力，适用于需要高速通信和低功耗的应用。内存配置包括128KB闪存和24KB RAM，结合4通道DMA控制器，优化数据传输效率。通信接口丰富，包括两个SPI模块、三个UART模块、一个低功耗UART、两个I2C接口（支持高达1 Mbps速率）和I2S模块。定时器系统包括一个8通道通用/PWM定时器、两个2通道定时器（带正交解码功能）、周期中断定时器、16位低功耗定时器和实时时钟（独立电源域）。安全模块如硬件CRC、128位唯一ID和闪存访问控制，增强系统可靠性。该器件适用于医疗设备、物联网节点和消费电子产品，电压适应范围广（1.71-3.6V），温度耐受-40°C至105°C。封装多样性如121 XFBGA和64 LQFP，便于集成到空间受限设计中。

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NXP Semiconductors

Data Sheet: Technical Data

K22P121M100SF9

Rev. 7, 08/2016

Kinetis K22F 128KB Flash

100 MHz ARM® Cortex®-M4 Based Microcontroller with FPU

The Kinetis K22 product family members are optimized for cost-

sensitive applications requiring low-power, USB connectivity,

high peripheral integration and processing efficiency with a

floating-point unit. These devices share the comprehensive

enablement and scalability of the Kinetis family.

This product offers:

• Run power consumption down to 120 μA/MHz. Static

power consumption down to 2.6 μA with full state retention

and 6 μs wakeup. Lowest static mode down to 120 nA.

• USB LS/FS OTG 2.0 with embedded 3.3 V, USB FS device

crystal-less functionality.

MK22FN128VDC10

MK22FN128VLL10

MK22FN128VMP10

MK22FN128VLH10

121 XFBGA (DC)

8 x 8 x 0.5 Pitch 0.65

100 LQFP (LL)

14 x 14 x 1.4 Pitch 0.5

64 MAPBGA (MP)

5 x 5 x 1.2 Pitch 0.5

64 LQFP (LH)

10 x 10 x 1.4 Pitch 0.5

Performance

• 100 MHz ARM Cortex-M4 core with DSP instructions

delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• 128 KB of embedded flash and 24 KB of RAM

• Serial programming interface(EzPort)

• Pre-programmed Kinetis flashloader for one-time, in-

system factory programming

System peripherals

• Flexible low-power modes, multiple wakeup sources

• 4-channel DMA controller

• Independent External and Software Watchdog monitor

Clocks

• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz or

3-32 MHz

• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz

• Multi-purpose clock generator with FLL

Security and integrity modules

• Hardware CRC module

• 128-bit unique identification (ID) number per chip

• Flash access control to protect proprietary software

Human-machine interface

• Up to 67 general-purpose I/O (GPIO)

Analog modules

• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)

• One 12-bit DAC

• Two analog comparators (CMP) with 6-bit DAC

• Accurate internal voltage reference

Communication interfaces

• USB LS/FS OTG 2.0 with on-chip transceiver

• USB full-speed device crystal-less operation

• Two SPI modules

• Three UART modules and one low-power UART

• Two I2C: Support for up to 1 Mbps operation

• I2S module

Timers

• One 8-channel general-purpose/PWM timer

• Two 2-channel general-purpose timers with

quadrature decoder functionality

• Periodic interrupt timers

• 16-bit low-power timer

• Real-time clock with independent power domain

• Programmable delay block

Operating Characteristics

• Voltage range (including flash writes): 1.71 to 3.6 V

• Temperature range (ambient): -40 to 105°C

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 17

2.2.7 Designing with radiated emissions in mind..........18

2.2.8 Capacitance attributes.........................................18

2.3 Switching specifications...................................................18

2.3.1 Device clock specifications..................................18

2.3.2 General switching specifications......................... 19

2.4 Thermal specifications..................................................... 20

2.4.1 Thermal operating requirements......................... 20

2.4.2 Thermal attributes................................................20

3 Peripheral operating requirements and behaviors.................. 21

3.1 Core modules.................................................................. 21

3.1.1 SWD electricals .................................................. 21

3.1.2 JTAG electricals.................................................. 22

3.2 System modules.............................................................. 25

3.3 Clock modules................................................................. 25

3.3.1 MCG specifications..............................................25

3.3.2 IRC48M specifications.........................................27

3.3.3 Oscillator electrical specifications........................28

3.3.4 32 kHz oscillator electrical characteristics........... 30

3.4 Memories and memory interfaces................................... 31

3.4.1 Flash electrical specifications.............................. 31

3.4.2 EzPort switching specifications........................... 32

3.5 Security and integrity modules........................................ 33

3.6 Analog............................................................................. 33

3.6.1

3.6.2

ADC electrical specifications............................... 34

CMP and 6-bit DAC electrical specifications....... 38

3.6.3 12-bit DAC electrical characteristics....................40

3.6.4 Voltage reference electrical specifications.......... 43

3.7 Timers..............................................................................44

3.8 Communication interfaces............................................... 44

3.8.1 USB electrical specifications............................... 45

3.8.2 DSPI switching specifications (limited voltage

range).................................................................. 45

3.8.3 DSPI switching specifications (full voltage

range).................................................................. 47

3.8.4 Inter-Integrated Circuit Interface (I2C) timing...... 48

3.8.5 UART switching specifications............................ 50

3.8.6 I2S/SAI switching specifications.......................... 50

Dimensions............................................................................. 56

4.1 Obtaining package dimensions....................................... 56

Pinout...................................................................................... 57

5.1 K22 Signal Multiplexing and Pin Assignments.................57

5.2 Recommended connection for unused analog and

digital pins........................................................................62

5.3 K22 Pinouts..................................................................... 63

Part identification.....................................................................67

6.1 Description.......................................................................67

6.2 Format............................................................................. 67

6.3 Fields............................................................................... 68

6.4 Example...........................................................................68

6.5 121-pin XFBGA part marking.......................................... 69

6.6 64-pin MAPBGA part marking......................................... 69

Terminology and guidelines.................................................... 69

7.1 Definitions........................................................................ 69

7.2 Examples......................................................................... 70

7.3 Typical-value conditions.................................................. 70

7.4 Relationship between ratings and operating

requirements....................................................................71

7.5 Guidelines for ratings and operating requirements..........71

8 Revision History...................................................................... 71

NXP Semiconductors

Kinetis K22F 128KB Flash, Rev. 7, 08/2016

935320274557相似产品对比

	935320274557	935320318528	935325864557	935320318557
描述	RISC Microcontroller	RISC Microcontroller	RISC Microcontroller	RISC Microcontroller
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
Reach Compliance Code	unknown	unknown	unknow	unknown
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

935320274557

935320274557概述

935320274557规格参数

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